Applied Materials, Inc.

Maxime Cayer

Youssef A Loldj

Tony H Tong

Daniel O Clark

Shaun W Crawford

Eric Rieske

Michael Johnson

Hemant P Mungekar

Jay J Jung

James Omer L'Heureux

Andreas Neuber

Dana Tribula

Ryan T Downey

Joseph A Van Gompel

Miroslav Gelo

John L Koenig

Mike M Huang

Gino Gerardo Crispieri

The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.

Method and system for detecting anomalies in a semiconductor processing system

Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.

Integrated controller solution for monitoring and controlling manufacturing equipment

Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, the integrated sub-fab system may employ Ethernet and/or RS232 Serial communications through an open platform of apparatus to achieve a reduced carbon footprint during electronic device manufacturing. For this example, the system could include a process tool set and controller linked by sensors or software interconnect with one or more sub-fab or local factory auxiliary systems that can be operated in one or more states of energy consumption. These one or more auxiliary systems can be switched between different levels of energy consumption, as required by the process, via the controller. For many auxiliary components or systems the integrated sub-fab system utilizes existing signal outputs, for others they may employ secondary sensors or monitors.

Controls interface solution for energy savings

Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of COequivalent emission. The system may monitor effluent process gases and energy use from the process tool and sub-fab equipment.

Energy savings and global gas emissions monitoring and display

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Chandler, AZ, United States of America

Maxime Cayer