Dana Tm4 Inc.

Maxime Caron

Francois Dube

Michel Brazeau

Pascal Fleury

Alexandre Marquis

Martin Houle

Jean-Philippe Dextraze

Yannick Philibert

Jean-Philippe Desbiens

Michel Tulane

An inverter assembly including a phase-control chamber and a direct current (DC) chamber. The phase-control chamber includes a direct current (DC) link capacitor electrically connected a control circuit board via multiple connectors. The DC chamber includes a ferrite filter fixed to a DC bus bar via a support component.

Inverter with capacitor discharge and DC bus filtering

An inverter is provided that includes a direct current (DC) bus bar assembly positioned within a DC chamber in the housing is provided herein. The inverter further includes a gate-driver circuit board included in a phase-control chamber in the housing, and an external communication interface in electronic communication with a power control circuit board and positioned in an external communication chamber in the housing. The DC chamber, the phase-control chamber, and the external communication chamber have varying levels of electromagnetic interference (EMI).

Inverter with housing chambers for electromagnetic interference (EMI) reduction

Systems are provided for a cooling system for an electric vehicle. In one example, a system includes a plate arranged between separate circuit boards. The plate directly cools one of the circuit boards and block thermal communication between the circuit boards.

Systems for thermal management of a vehicle

A thermal interface for discrete semiconductor devices (such as IGBT's) having a thermally conductive structure, a PCB populated with discrete electronic components, and each of the discrete semiconductor devices having a housing extending beyond the edge of the PCB and in a direction substantially parallel to a plane of the PCB, and a clamp bar secured to the thermally conductive structure adapted to compressively secure each housing to the thermally conductive structure and adapted to maintain thermal contact between a surface of each housing and the surface of the thermally conductive structure. A thermally conductive and electrically insulative pad is positioned between the semiconductor device housing and the thermally conductive structure. A casing enclosing the interface and PCB includes the thermally conductive structure formed on a backwall of the casing.

Growing community of inventors

Montreal, Canada

Maxime Caron