Growing community of inventors

Oronoco, MN, United States of America

Max John Christopher Koschmeder

Average Co-Inventor Count = 2.65

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 70

Max John Christopher KoschmederDon Alan Gilliland (4 patents)Max John Christopher KoschmederMichael Scott Good (2 patents)Max John Christopher KoschmederMatthew Allen Butterbaugh (1 patent)Max John Christopher KoschmederCary Huettner (1 patent)Max John Christopher KoschmederRaymond Floyd Babcock (1 patent)Max John Christopher KoschmederGary Allen Thompson (1 patent)Max John Christopher KoschmederKevin R Qualters (1 patent)Max John Christopher KoschmederWilliam Michael Monson (1 patent)Max John Christopher KoschmederBrian Joseph Stanczyk (1 patent)Max John Christopher KoschmederJerry Richard Rasmussen (1 patent)Max John Christopher KoschmederWesley H Bachman (1 patent)Max John Christopher KoschmederTodd Douglas Green (1 patent)Max John Christopher KoschmederMax John Christopher Koschmeder (6 patents)Don Alan GillilandDon Alan Gilliland (84 patents)Michael Scott GoodMichael Scott Good (21 patents)Matthew Allen ButterbaughMatthew Allen Butterbaugh (33 patents)Cary HuettnerCary Huettner (22 patents)Raymond Floyd BabcockRaymond Floyd Babcock (14 patents)Gary Allen ThompsonGary Allen Thompson (10 patents)Kevin R QualtersKevin R Qualters (8 patents)William Michael MonsonWilliam Michael Monson (7 patents)Brian Joseph StanczykBrian Joseph Stanczyk (6 patents)Jerry Richard RasmussenJerry Richard Rasmussen (6 patents)Wesley H BachmanWesley H Bachman (3 patents)Todd Douglas GreenTodd Douglas Green (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. International Business Machines Corporation (6 from 164,221 patents)


6 patents:

1. 7573709 - Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

2. 7564690 - Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

3. 7327577 - Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

4. 6818822 - Conductive gasket including internal contact-enhancing strip

5. 6335868 - Enhanced enclosure arrangement for a computer

6. 6267614 - Low profile/high leverage electronic computer book latching system

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as of
12/30/2025
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