Hzo, Inc.

Other

Max Ernest Sorenson

Blake LeRoy Stevens

Tyler Christensen Child

Cameron LaMar Loose

Vimal Kumar Kasagani

David James Astle

Marc Kenneth Chason

Marcellus Harper

Jason Maynard

Layton Baker

Scott B Gordon

Rick C Peterson

Yang Yun

Tining Su

Alex L Anderson

Alan Rae

Liulei Cao

James Kent Naylor

Chien-Lan Hsueh

Sidney Edward Martin, Iii

Paul S Clayson

Jianhua Su

Dana Cox

Jim Dempster

A coating apparatus may be configured to concurrently receive and waterproof a large number of electronic device assemblies. The coating apparatus may include a track for transporting the electronic device assemblies into an application station. The application station may have a cubic shape, and include an entry door and an opposite exit door. The entry and exit doors may enable the introduction of substrates into the application station, as well as their removal from the application station. In addition, the entry and exit doors may enable isolation of the application station from an exterior environment and, thus, provide control over the conditions under which a moisture resistant material is applied to the substrates. Methods for making electronic devices and other substrates resistant to moisture are also disclosed.

Apparatuses, systems and methods for applying protective coatings to electronic device assemblies

A mask material is readily discernible from a substrate to which the mask material is applied. The mask material may have a discernible characteristic, such as its color, luminescence or the like, which may render it visibly distinct from the substrate or detectable using automated inspection equipment. The discernible characteristic of the mask material may render it detectable through a protective coating.

Materials for masking substrates and associated methods

A modular multilayer deposition system includes a plurality of modular deposition chambers, including at least one parylene deposition chamber and at least one ALD deposition chamber. The parylene deposition chamber is connected in series with the ALD deposition chamber. Substrates are automatically moved from within the parylene deposition chamber to within the ALD deposition chamber or from within the ALD deposition chamber to the parylene deposition chamber.

Multi-layer deposition system and process

Systems, devices and methods for sensing moisture within an electronic device are disclosed. A device may include a housing and a display defining and exterior of an electronic device and an interior of the electronic device. Further, the device may include an integrated circuit (IC) within the electronic device and comprising a control element. The device may also include a moisture sensor such as an inductive sensor, a capacitance sensor, or both. The moisture sensor, which may be part of the IC, together with the control element may sense moisture within the electronic device.

Methods, apparatuses and systems for sensing exposure of electronic devices to moisture

A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

Masking substrates for application of protective coatings

A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

Method for manufacturing an electronic device

A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

Electronic devices with internal moisture-resistant coatings

An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.

System for refurbishing or remanufacturing an electronic device

The disclosure extends to moisture resistant energy storage devices, such as rechargeable batteries, and associated methods of forming the same. An energy storage device, such as a rechargeable battery, may comprise a cell including at least one electrical terminal and a circuit board electrically coupled to the at least one electrical terminal. The rechargeable battery may also include a moisture resistant coating on at least a portion of at least one of a surface of the cell and a surface of the circuit board. A moisture resistant coating may reside between the circuit board and the cell.

Moisture resistant energy storage devices and associated methods

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

Removal of selected portions of protective coatings from substrates

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

Methods for masking and applying protective coatings to electronic assemblies

Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

Methods for applying protective coatings to internal surfaces of fully assembled electronic devices

Systems and methods for monitoring the moisture to which an electronic device is exposed may alter or vary operation of the electronic device. Operation of the electronic device may be altered or varied to provide a notification that the electronic device has been exposed to moisture. When an electronic device is exposed to moisture, an operational mode of the electronic device may be changed. A change in the operational mode of the electronic device may include termination of the supply of power to one or more components, which may protect those components. Programs or apps that provide a user of the electronic device with information regarding exposure of the electronic device to an amount of moisture that meets or exceeds a moisture response threshold are also disclosed.

Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture

The disclosure extends to protectively coated energy storage devices, such as rechargeable batteries, and associated methods of forming the same. An energy storage device, such as a rechargeable battery, may comprise a cell including at least one electrical terminal and a circuit board electrically coupled to the at least one electrical terminal. The rechargeable battery may also include a protective coating on at least a portion of at least one of a surface of the cell and/or at least one surface of the circuit board. The protective coating may reside between the circuit board and the cell. The protective coating may comprise a moisture resistant coating that will withstand exposure to corrosive agents, including electrolytes, corrosive gases and dust.

Growing community of inventors

Herriman, UT, United States of America

Max Ernest Sorenson