Honeywell International Inc.

Honeywell G.m.b.h.

Max C Glenn

Jon B DCamp

Harlan L Curtis

Lori A Dunaway

Robert D Horning

Mark W Weber

Cleopatra Cabuz

Raymond F McMullen

Francis M Erdmann

David W Burns

William P Platt

Burgess R Johnson

Jeff A Ridley

Douglas W Wilda

Timothy J Hanson

William A Harris

David B Wamstad

Drew A Karnick

James V Davidson

James C Nohava

David K Arch

Thomas P Overholt

Bryan Seppala

Jane Rekstad

Jon Dcamp

Jame Rekstad

A micro-electro-mechanical systems (MEMS) device comprises at least one proof mass configured to have a first voltage and a motor motion in a first horizontal direction. At least one sense plate is separated from the proof mass by a sense gap, with the sense plate having an inner surface facing the proof mass and a second voltage different than the first voltage. A set of stop structures are on the inner surface of the sense plate and are electrically isolated from the sense plate. The stop structures are configured to prevent contact of the inner surface of the sense plate with the proof mass in a vertical direction. The stop structures have substantially the same voltage as that of the proof mass, and are dimensioned to minimize energy exchange upon contact with the proof mass during a shock or acceleration event.

MEMS device mechanism enhancement for robust operation through severe shock and acceleration

A package assembly comprises a package base, a sensor die, an isolation plate, and a package interface plate. The isolation plate is bonded to the sensor die and has a plurality of flexible beams. Each flexible beam is configured to deflect under stress such that effects on the sensor die of a thermal mismatch between the package base and the sensor die are reduced. The package interface plate is bonded to the isolation plate and the package base. The package interface plate is configured to limit the maximum distance each flexible beam is able to deflect.

Package interface plate for package isolation structures

A micro-electromechanical systems (MEMS) device includes a substrate comprising at least one anchor, a proof mass having first and second deceleration extensions extending therefrom, a motor drive comb, a motor sense comb, a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb. The suspensions are anchored to the substrate. A body is attached to the substrate. At least one deceleration beam extends from a first side of said body. The at least one deceleration beam is configured to engage at least one of the first and second deceleration extensions and slow or stop the proof mass before the proof mass contacts the motor drive comb and the motor sense comb.

Multistage proof-mass movement deceleration within MEMS structures

An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.

Saw debris reduction in MEMS devices

A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and lower plates made in accordance with upper sense plate design. The MEMS die is mounted to the bottom section. The upper and lower plates form a cavity that receives a MEMS device. The upper and lower plates are bonded by one or more bond pads and a seal ring that surrounds the cavity. The seal ring includes grooves that allow exposure of the cavity to the space within the package. A getter material applied to a top surface of the MEMS die on the upper plate. The getter material is activated during or after the lid is mounted to the bottom section.

Getter on die in an upper sense plate designed system

An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

Chip packaging systems and methods

A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

Methods and apparatus for particle reduction in MEMS devices

A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.

Methods and apparatus for attaching getters to MEMS device housings

A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at leastkilograms of force per gram of bonding material to the housing, the contacts, and the die.

Methods and apparatus for attaching a die to a substrate

A method for providing micro-electromechanical systems (MEMS) devices with multiple motor frequencies and uniform motor-sense frequency separation is described. The devices each include at least one proof mass, each proof mass being connected to a substrate by a system of suspensions. The method includes controlling the resonant frequencies of the MEMS device by adjusting at least two of a mass of the proof masses, a bending stiffness of the proof masses, a length of the suspensions, and a width of the suspensions.

Methods and systems for simultaneously fabricating multi-frequency MEMS devices

Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

Methods for reducing the curvature in boron-doped silicon micromachined structures

A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.

Growing community of inventors

Chanhassen, MN, United States of America

Max C Glenn