Pi R&d Co., Ltd.

Mori Polymer Co., Inc.

Mitsubishi Electric Corporation

Mitsubishi Cable Industries, Ltd.

Maw Soe Win

Toshiyuki Goshima

Sigemasa Segawa

Eika Kyo

Takaki Mori

Shintaro Nakajima

Junichi Yamashita

Takahiro Sato

Toshihiro Zushi

Ken Takanashi

Yoshikazu Nishikawa

Masanori Fujii

Hiromasa Honjo

Kiyoshi Ishii

Shuzo Waki

Isao Sakata

Hidenao Takato

Toyokazu Nagato

Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a &#x3c0;-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.

Conductive agent for battery electrode, electrode containing the same, and battery

Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.

Polyimide resin composition for use in forming reverse reflecting layer in photovoltaic cell and method of forming reverse reflecting layer in photovoltaic cell used therewith

Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.

Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices

Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.

Photosensitive modified polyimide resin composition and use thereof

The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof. According to the method in which an isocyanate-terminated oligomer comprising a polycarbonate component having excellent flexibility is allowed to react with a tetracarboxylic dianhydride to synthesize a tetracarboxylic dianhydride oligomer comprising the polycarbonate component and the thus obtained oligomer is then further allowed to react with an aromatic diamine and aromatic tetracarboxylic dianhydride to produce a polyimide block copolymer, by selecting the aromatic diamine from a wide range of selectable aromatic diamines, an excellent modified polyimide satisfying all of the above-described various characteristics can be produced.

Modified polyimide and method for producing modified polyimide

A suspension type electrodeposition coating composition containing, as a resin component, block copolyimide having a siloxane bond in a molecular structure and an anionic group in a molecule. Preferably, the above-mentioned block copolyimide contains, as one of the diamine components, diamine having a siloxane, bond in a molecular structure. In addition, preferably, the above-mentioned anionic group is a carboxylic acid group or a salt thereof and/or a sulfonic acid group or a salt thereof. The electrodeposition coating composition has superior heat resistance, which does not easily develop peeling and cracks in the electrodeposited body, and is capable of efficiently forming a high-insulation electrodeposited film superior in the uniformity of film property.

Electrodeposition coating material and electrodeposition method

Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.

Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof

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Yokohama, Japan

Maw Soe Win