Stmicroelectronics S.r.l.

Mauro Scandiuzzo

Roberto Antonio Canegallo

Eleonora Franchi Scarselli

Roberto Guerrieri

Antonio Gnudi

Salvatore Valerio Cani

Pier Luigi Rolandi

Roberto Cardu

Claudio Mucci

Alberto Pagani

Luca Perugini

Federico Natali

Luca Perilli

An asynchronous level shifter electronic circuit including: a transmitter, which can be coupled to a first voltage and generates a communication signal; a receiver, which can be coupled to a second voltage; and a capacitive coupling stage, which receives the communication signal and supplies a corresponding filtered signal to the receiver. The receiver includes: a threshold device, which has an input terminal and an output terminal and switches an electrical quantity on the output terminal between a first value and a second value, as a function of corresponding transitions through a threshold of a first intermediate signal present on the input terminal, to generate a second intermediate signal; and a biasing circuit, which generates the first intermediate signal to have a d.c. component, which is a function of the second intermediate signal, and superposed on which is a variable component, which is a function of the filtered signal.

Capacitive coupling, asynchronous electronic level shifter circuit

A testing apparatus includes a tester and a probe card system that includes a probe card connected to the tester, and an active interposer connected to the probe card and wirelessly coupled with a device to be tested. The active interposer includes pads positioned on its free surface facing the device. The pads are positioned with respect to pads of the device so that each pad of the active interposer faces a pad of the device and is separated therefrom by a dielectric. Each pair of facing pads forms an elementary wireless coupling element which allows a wireless transmission between the active interposer and the device. The active interposer also includes an amplifier circuit configured to amplify wireless signals from the device before forwarding them to the tester. The probe card system includes a transmission element able to transmit a power voltage from the tester to the device.

Active probe card for electrical wafer sort of integrated circuits

A method includes communicatively coupling first and second integrated electronic devices together through a plurality of reference capacitors, transmitting a plurality of transmission reference signals on transmission reference electrodes of the plurality of reference capacitors, receiving coupling signals on reception reference electrodes of the plurality of reference capacitors, amplifying said coupling signals, generating a plurality of reception reference signals, generating a plurality of reception control signals as a function of the plurality of reception reference signals, and detecting a possible misalignment between said first and second integrated electronic devices based on the plurality of reception control signals.

Method for verifying the alignment between integrated electronic devices

An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding to the first surface; a second substrate having a second surface, housing a third electrical-interconnection element and a fourth electrical-interconnection element in a position corresponding to the second surface, and provided with a dielectric layer extending on top of the third interconnection element; and a first bump and a second bump made of conductive material, extending between the first electrical-interconnection element and the third electrical-interconnection element and, respectively, between the second electrical-interconnection element and the fourth electrical-interconnection element, at least partially aligned to the respective electrical-interconnection elements, the first bump being ohmically coupled to the first interconnection element and capacitively coupled to the third interconnection element, and the second bump being ohmically coupled to the second interconnection element and to the fourth interconnection element.

Substrate assembly provided with capacitive interconnections, and manufacturing method thereof

Contactless differential coupling structures can be used to communicate signals between circuits located on separate chips or from one chip to a probing device. The contactless coupling structures avoid problems (breaks, erosion, corrosion) that can degrade the performance of ohmic-type contact pads. The contactless coupling structures comprise pairs of conductive pads placed in close proximity. Differential signals are applied across a first pair of differential pads, and the signals are coupled wirelessly to a mating pair of conductive pads. Circuitry for generating and receiving differential signals is described.

Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing

An embodiment of communication cell for enabling data communication between an integrated circuit and an electronic unit distinct from the integrated circuit, comprising a contact pad unit, configured for capacitively coupling, in a first operating condition of said communication cell, to the electronic unit for receiving an input signal from said electronic unit, and for ohmically coupling, in a second operating condition of said communication cell, to the electronic unit for receiving the input signal; a receiver device, including signal-amplifying means, coupled between said contact pad unit and said integrated circuit, configured for receiving the input signal and generating an intermediate signal correlated to the input signal; signal-selection means receiving the intermediate signal, the input signal, and providing an output signal which is the intermediate signal during the first operating condition, and the input signal during the second operating condition; and an input stage, connectable between the integrated circuit and the output terminal of the signal-selection means, configured for receiving the output signal and providing the output signal to the integrated circuit.

Communication cell for an integrated circuit, chip comprising said communication cell, electronic system including the chip, and test apparatus

A device and method to compensate for distortions of amplitude that afflict systems for communicating through capacitive coupling. A circuit includes a first transmitter stage, a first receiver stage, and a first coupling capacitor, coupled between the first transmitter stage and the first receiver stage. The first receiver stage includes a calibration amplifier of a variable-gain type coupled between the first coupling capacitor and an output of the electronic circuit. The electronic circuit includes a reference channel formed by: a transmission calibration stage; a reception calibration stage; and a reference capacitor coupled between the transmission calibration stage and the reception calibration stage. The reception calibration stage includes: a reception amplifier of a variable-gain type, having an input coupled to the reference capacitor, and a gain controller, having an input coupled to an output of the reception amplifier and an output coupled to control terminals of the reception and calibration amplifiers.

Electronic circuit for communicating through capacitive coupling

A method for verifying alignment between first and second integrated devices coupled together using a reference and a coupling capacitor, including: transmitting a reference signal on a transmission electrode of the reference capacitor; receiving a coupling signal on a reception electrode of the reference capacitor; amplifying the coupling signal, generating a reception reference signal; generating a reception control signal as a function of the reception reference signal; transmitting a communication signal on an electrode of the coupling capacitor; receiving a reception signal on an electrode of the coupling capacitor; amplifying the reception signal, generating a first compensated signal; controlling a level of amplification of amplifying the coupling signal and the reception signal as a function of the reception control signal; and detecting a possible misalignment between the first and second devices based on an amplitude of the communication signal and an amplitude of the compensated signal.

Growing community of inventors

Torrazza di Cambiago, Italy

Mauro Scandiuzzo