Stmicroelectronics S.r.l.

Sgs-thomson Microelectronics S.r.l.

Mauro Mazzola

Renato Poinelli

Matteo De Santa

Battista Vitali

Roberto Tiziani

Roberto Brioschi

Paolo Casati

Fabio Marchisi

A semiconductor device includes a pre-molded leadframe mounting substrate. The substrate includes a die pad (configured to have a semiconductor die mounted thereon) and a first electrically conductive pad and a second electrically conductive pad. A strip of insulating material is molded between the first and second electrically conductive pads to provide a mutually electrically insulation and extends in a longitudinal direction with the first electrically conductive pad and the second electrically conductive pad lying on opposite sides of the strip of insulating material. A semiconductor die is arranged on the die pad in register with the strip of insulating material. A single electrically conductive ribbon extending in register with the strip of insulating material electrically couples the semiconductor die with both the first and second electrically conductive pads to provide a common current flow path from the semiconductor die towards the first and the second electrically conductive pads.

Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurations

A pre-molded leadframe includes a laminar structure having empty spaces therein and a first thickness with a die pad having opposed first and second die pad surfaces. Insulating pre-mold material is molded onto the laminar structure. The pre-mold material penetrates the empty spaces and provides a laminar pre-molded substrate having the first thickness with the first die pad surface left exposed. The die pad has a second thickness that is less than the first thickness. One or more pillar formations are provided protruding from the second die pad surface to a height equal to a difference between the first and second thicknesses. With the laminar structure clamped between surfaces of a mold, the first die pad surface and pillar formations abut against the mold surfaces. The die pad is thus effectively clamped between the clamping surfaces countering undesired flashing of the pre-mold material over the first die pad surface.

Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die pad

In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool

A leadframe for semiconductor devices, the leadframe comprising a die pad portion having a first planar die-mounting surface and a second planar surface opposed the first surface, the first surface and the second surface having facing peripheral rims jointly defining a peripheral outline of the die pad wherein the die pad comprises at least one package molding compound receiving cavity opening at the periphery of said first planar surface.

Leadframe for semiconductor devices, corresponding semiconductor product and method

A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to a face corresponding to an active side of one or more electronic dice, flipping the one or more electronic dice so that said face corresponding to an active side of one or more electronic dies is facing a leadframe carrying contacting pads in correspondence of said conducting bump pads, bonding said contacting pads to said conducting bump pads and encasing said one or more electronic dice in a casing by a molding operation. The process includes providing a leadframe having contacting pads presenting a recessed surface in correspondence of the position of said conducting bump pads.

Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package

A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

Thermosonically bonded connection for flip chip packages

A method for encapsulating an electronic device is provided. The electronic device includes an integrated circuit, a lead frame for supporting the integrated circuit and having peripheral leads integrally formed therewith, and a heat sink thermally coupled to the lead frame. The heat sink includes an extension extending therefrom in a direction towards a corner of the electronic device. The method includes positioning the electronic device within a mold that includes a gate therein that is adjacent to and parallel with the extension. Molten insulative material is injected through the gate and into the mold for encapsulating the integrated circuit, and at least a portion of the lead frame and the heat sink.

Method for manufacturing semiconductor device packages

A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset.

Offset edges mold for plastic packaging of integrated semiconductor devices

A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate that is arranged on the bottom of the plastic package and has thinner ends, wherein the length of the heat sink plate is at least equal to the minimum length of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

Plastic body surface-mounting semiconductor power device having

A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means. Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator. According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.

Growing community of inventors

Calvenzano, Italy

Mauro Mazzola