Stmicroelectronics S.r.l.

Mauro Alessandri

Barbara Crivelli

Cesare Clementi

Gabriella Ghidini

Francesco Maria Pipia

Romina Zonca

Enrico Bellandi

A process for manufacturing a non-volatile memory cell having at least one gate region, the process including the steps of depositing a first dielectric layer onto a semiconductor substrate; depositing a first semiconductor layer onto the first dielectric layer to form a floating gate region of the memory cell; and defining the floating gate region of the memory cell in the first semiconductor layer. The process further includes the step of depositing a second dielectric layer onto the first conductive layer, the second dielectric layer having a higher dielectric constant than 10. Also disclosed is a memory cell integrated in a semiconductor substrate and having a gate region that has a dielectric layer formed over a first conductive layer and having a dielectric constant higher than 10.

Manufacturing process of a semiconductor non-volatile memory cell

A process manufactures an interpoly dielectric layer for non-volatile memory cells of a semiconductor device with an interpoly dielectric layer. The process begins with forming the tunnel oxide, and hence the amorphous or polycrystalline silicon layer, using conventional techniques. After the amorphous or polycrystalline silicon layer is surface cleansed and passivated, the surface of the polycrystalline layer is nitrided directly by using radical nitrogen. This is followed by the formation of the interpoly dielectric, either as an ONO layer or a single silicon layer, by means of the CVD technique. Masking to define the floating gate may be performed immediately before or after the direct nitridation step is carried out. The equivalent electrical thickness of the interpoly dielectric, obtained by combining the nitride oxide layer and by the following dielectric, does not exceed 130 Angstroms in either the ONO layer or the single silicon layer embodiment.

Manufacturing process of an interpoly dielectric structure for non-volatile semiconductor integrated memories

The present invention relates to a process for removing post-etch residues or polymers from the surface of semiconductor devices which comprises treating the semiconductor device with an aqueous ammonia or ammonium hydroxide solution, optionally containing ozone for a time sufficient to effectively remove said post-etch residues or polymers from the surface of the semiconductor device and rinsing the semiconductor device with ozonized water, i.e. water enriched with ozone, in which water is preferably deionized (ozone-DIW).

Process for removing polymers during the fabrication of semiconductor devices

A process of fabricating a floating-gate memory device, the process including the steps of: forming a stack of superimposed layers including a floating gate region, a dielectric region, and a control gate region; and forming an insulating layer of oxynitride to the side of the floating gate region to completely seal the floating gate region outwards and improve the retention characteristics of the memory device. The insulating layer is formed during reoxidation of the sides of the floating gate region, after self-align etching the stack of layers and implanting the source/drain of the cell.

Growing community of inventors

Vimercate, Italy

Mauro Alessandri