Stmicroelectronics S.r.l.

Sgs-thomson Microelectronics S.r.l.

Micron Technology Incorporated

Maurizio Giovanni Gaibotti

Michelangelo Pisasale

Antonino Conte

Tommaso Zerilli

Carmela Calafato

Michele La Placa

Domenico Pappalardo

Maurizio Secol

Nicolas Demange

Francesco Adduci

Flavio Scarra

Gaetano Palumbo

Francesco Sorrentino

Vincenzo Sambataro

Luca Lo Coco

Flavio Scarra'

Giampiero Trupia

Stefano Lo Giudice

Marco Costanzo

Apparatuses and methods for power regulation based on input power using circuitry are disclosed herein. An example apparatus may include a reference circuit configured to receive a first voltage and a second voltage and to provide an output reference voltage at an output node having a value equal to the second voltage subtracted from the first voltage. The reference circuit may be configured to mirror a current of a first circuit coupled between the second voltage and a reference voltage through a second circuit coupled between the first voltage and the output node. The example apparatus may further include a power circuit configured to provide a third voltage based on the output reference voltage. The third voltage may have a value that is equal to the output reference voltage.

Apparatuses and methods for power regulation based on input power

An architecture for implementing an integrated capacity includes a capacitive block inserted between first and second voltage reference. The block is formed The block is formed from elementary capacitive modules. An enable block is inserted between the first voltage reference and the capacitive block and includes switches connected to the elementary capacitive modules and driven on their control terminals by control signals. Each switch of the enable block is inserted between the first voltage reference and a first end of a corresponding elementary capacitive module. A verify and enable circuit is connected to the first voltage reference, as well as at the input of the first end of the elementary capacitive modules and at the output of the control terminals of the switches of the enable block. The verify and enable circuit detects the presence of a current value in each of the elementary capacitive modules and, if said current is detected, disables that elementary capacitive module of the capacitive block using the corresponding switch of the enable block.

Architecture for implementing an integrated capacitance

A voltage-down converter for providing an output voltage lower than a power supply voltage of the converter is proposed. The converter includes voltage regulation means for obtaining an intermediate voltage corresponding to the output voltage from the power supply voltage by controlling a variable-conductivity element with a control signal resulting from a comparison between the intermediate voltage and a reference voltage, and an output stage for obtaining the output voltage from the power supply voltage by controlling a further variable-conductivity element with the control signal, wherein the further variable-conductivity element has a modular structure with at least one set of multiple basic modules, the converter further including means for enabling and/or disabling the modules of each set in succession according to a comparison between the output voltage and the intermediate voltage.

Voltage down-converter with reduced ripple

The charge pump uses PMOS transistors for implementing the first and the second charge transfer switches of the charge pump. Substantially, the closing and opening of the first switch through which the first capacitor is charged, of the second switch for transferring the electric charge from the first capacitor to the load capacitance connected to the output node of the circuit and of the third switch for discharging to ground the load capacitance, are driven by a logic NOR gate. A first input of the NOR gate is connected to a common control node of the PMOS transistor forming the second switch and of a NMOS transistor forming the third switch, a second inverting input is connected to the output node, and the output is connected to the first capacitor.

Integrated charge pump voltage booster

A variable charge pump contains several individual simple charge pumps, each with a pumping capacitor and a switching mechanism. Additionally, a switching network is coupled to the individual charge pumps so that the different lines in the charge pump can be connected together in a serial mode or parallel mode (or mixed serial and parallel modes) to match the needs of the output load. The switching network is easily changed to provide the necessary driving capability as the needs of the output load changes.

Variable stage charge pump

A generator circuit for voltage ramps is provided that includes a differential stage with positive feedback coupled between a first and a second voltage reference and having a first output connected to a control terminal of a first output transistor. The first output transistor is connected at an output terminal of the ramp generator circuit to a capacitive charge to be biased with voltage ramps. The ramp generator circuit also includes a second output transistor parallel connected to the first output transistor and having the control terminal connected to a second output of the differential stage.

Generator circuit for voltage ramps and corresponding voltage generation method

A sense amplifier of the type coupled to a reference bit line and at least one cell array bit line. The sense amplifier includes an amplifying stage and a current voltage conversion circuit that compare a reference current from the reference bit line and a cell current from the cell array bit line. The current-voltage conversion circuit includes a voltage setting circuit for setting predetermined voltages on the reference bit line and the cell array bit line, a load circuit for the reference bit line and the cell array bit line, and current mirror circuits for mirroring the reference current and the cell current into the amplifying stage. The load circuit for the reference bit line and the current mirror circuit for the reference current are different circuits, and the load circuit for the reference bit line includes a transistor that mirrors a predetermined current that is generated outside of the sense amplifier. Another embodiment provides a sense amplifier that includes a first current mirror having one branch coupled to a cell array bit line, and a second current mirror having a branch coupled to both a reference bit line and another branch of the first current mirror. In one preferred embodiment, the second current mirror mirrors a predetermined current that is generated outside of the sense amplifier. A method for sensing the current of a memory cell in a memory device is also provided.

Sense amplifier for low voltage memories

A CMOS technology voltage booster having plurality of charge-pump stages cascade connected together and driven by a plurality of phases, each stage having a terminating input node and a terminating output node, with at least one transistor connected therebetween that has its control terminal connected to an internal circuit node of the same stage and applied one of the phases. This voltage booster further includes a pair of additional circuit elements for transferring, onto the internal node, a potential exceeding the voltage at the input node by at least one threshold. A first of the additional elements is essentially a MOS transistor having its control terminal connected to the control terminal of that transistor that is connected between the input and the output of the stage, while the second additional element is an auxiliary capacitor having one end connected directly to the first additional element and connected to the internal node through a transistor.

CMOS technology voltage booster

A memory read amplifier circuit includes at least one memory cell to be read and a bit line connected thereto, a first pre-charge amplifier circuit connected to the bit line. A first cascode circuit is connected between a supply voltage and the memory cell for providing a first current to the memory cell. The memory read amplifier circuit also includes at least one reference memory cell and a reference bit line connected thereto, and a second pre-charge amplifier circuit connected to the reference bit line. A second cascode circuit is connected between the supply voltage and the reference memory cell for providing a second current to the reference memory cell. A differential comparator circuit having a first input is connected to the control terminal of the first cascode circuit for receiving a first voltage based upon the first current, and a second input connected to the control terminal of the second cascode circuit for receiving a second voltage based upon the second current. The differential comparator circuit compares the first and second voltages for providing a logic value relegates to a state of the memory cell to be read.

Memory read amplifier circuit with high current level discrimination capacity

A bias circuit for read amplifier circuits for memories includes at least one first circuit branch formed by a first pair of MOS transistors connected between a supply voltage and ground. The first pair of MOS transistors includes a P-channel diode connected transistor and an N-channel transistor connected in series, with an enable transistor interposed therebetween. The first circuit branch drives a capacitive load for coupling to the supply voltage. The bias circuit further includes reference current amplifier circuit branches for amplifying a reference current which flows in the first circuit branch for charging the capacitive load. A circuit portion, which controls the charging current of the capacitive load, includes a feedback loop between the reference current amplifier circuit branches and the capacitive load.

Bias circuit for read amplifier circuits for memories

A voltage phase generator that generates a normal voltage phase, a negated normal voltage phase, a boosted voltage phase, and a negated boosted voltage phase. The voltage phase generator includes a first driver circuit that supplies the normal voltage phase to a first output node, and a second driver circuit that supplies the negated normal voltage phase to a second output node. The first and second driver circuits are driven by additional voltage phases that have a boosted voltage. In one preferred embodiment, each of the driver circuits includes a pull-up connected between a supply voltage and one of the output nodes, and a pull-down connected between ground and the one output node. Additionally, the present invention provides a voltage boosting circuit that includes a booster circuit and a voltage phase generator. The booster circuit receives four voltage phases and generates a boosted voltage, and the voltage phase generator generates the four voltage phases and additional voltage phases that have a boosted voltage. The additional voltage phases drive driver circuits that supply the normal voltage phase and the negated normal voltage phase to the booster circuit. In a preferred embodiment, the voltage boosting circuit is integrated in a low supply voltage circuit device.

Voltage phase generator with increased driving capacity

A shielded electrical connection of the integrated type comprises a connection element and a shielding element. The connection element includes a first substantially planar structure of a first conducting material and is placed vertically above and isolated from a semiconductor substrate and which occupies a first flat region. The shielding element includes a second substantially planar structure of a second conducting material and is placed vertically between the first structure and the substrate and which occupies a second flat region. A third substantially planar structure made of a third conducting material is placed vertically above the first structure and which occupies a third flat region. The first region does not extend outside the second and third regions. Furthermore, the second and third structures are connected electrically together and to a reference of potential and are electrically insulated from the first structure and the substrate.

Integrated shielded electric connection

A first current generator which generates a current that is based on the threshold difference of enhancement-type and native-type transistors therein. A second current generator which generates a current that is based on the thermal voltage. The currents generated by the first and second current generators are linearly combined to produce a highly temperature-stable current.

Growing community of inventors

Cesano Maderno, Italy

Maurizio Giovanni Gaibotti