International Business Machines Corporation

Maurice Francis Holahan

Arvind Kumar Sinha

Eric Vance Kline

Eric Alan Eckberg

Don Alan Gilliland

Paul N Krystek

Michael Robert Rasmussen

Stephen M Zins

James Dorance Gerken

Michael J Ellsworth, Jr

Madhusudan K Iyengar

Robert E Simons

Richard C Chu

Levi A Campbell

Roger R Schmidt

William James Anderl

John Lee Colbert

John Saunders Corbin, Jr

Matthew Allen Butterbaugh

Roger Duane Hamilton

Cary Huettner

Ethan E Cruz

James L Peacock

David R Motschman

Gerard Frances Muenkel

James R Thorpe

Jason Thomas Stoll

William D Corfits

Joseph Daniel Rico

Louis Edward Behrens

Gregory Scott Vande Corput

Susan J Martino

Rebecca N Wagner

H Burt Stone

Paul Daniel Pederson, Jr

Dale Lidberg

An apparatus for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

Dual magnetically coupled rotor heat exchanger

A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

Duplex flexible heat exchanger

An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Heat sink apparatus with extendable pin fins

An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device.

Method and apparatus for a low impedance anti-recirculation air moving inlet device

A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.

Flux-free detachable thermal interface between an integrated circuit device and a heat sink

A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.

High performance dual-in-line memory (DIMM) array liquid cooling assembly and method

Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.

Modified hexagonal perforated pattern

An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM.

Enhancing the cooling of dual in-line memory modules

Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

Dynamic air moving system

A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

Non-influencing fastener for mounting a heat sink in contact with an electronic component

There is disclosed an apparatus and method for protecting electronic devices against excessive heat build-up and particulate infiltration while implementing EMC shielding.

Method and apparatus for protecting electronic devices against particulate infiltration, excessive heat build-up, and for implementing EMC shielding

The design of an electro-magnetic radiation suppression shield and cooling housing for a computer, server or other electronic device having a computer processor may be greatly enhanced and expedited by a test apparatus that permits the placement of electro-magnetic radiation suppression plates at differing locations, spacings and alignments, which allows a variance in positioning the electro-magnetic radiation source. The test apparatus not only has an air flow cooling opening in which an electro-magnetic radiation suppression panel forms cooling air flow holes but also a fixture for disposing a second similar electromagnetic radiation suppression panel at a distance from the first electro-magnetic radiation suppression panel. Each of the panels may be substituted to test various designs. The test apparatus further is provided with a telescoping support projecting into the interior cavity so that the electromagnetic radiation source may be moved about in the interior and thus simulate a large number of positions and conditions. The test apparatus provides a greatly enhanced tool in the trial and error approach to electro-magnetic radiation control.

Apparatus for testing various structural parameters of an electro-magnetic radiation barrier

A fan check valve is formed from plastic film having an outer edge and a central region. The valve also has a number of slits that define flaps in the film. The flaps are symmetrically arrayed in a spiral-like pattern between the central region and the outer edge. The valve mounts to the outer surface of a tube axial fan. Under normal operating conditions, the fan moves a helical flow of air in a generally axial direction toward through the valve. The flaps are blown open and align with the oncoming flow at low angles of attack to minimize dynamic losses. The flaps are in the closed position and lie flush on the outer surface of the exhaust plate mounted on the fan at all other times to prevent airflow back through the fan in the opposite direction once the fan has failed.

Helically conforming axial fan check valve

A side-by-side double row of electronics packages plug into a common backplane. Cooling air flows in an (upside down) omega-shaped path turning into one row of packages, flowing through that row, turning through an air-moving device into a plenum chamber, then turning into the second row of packages, and out of the second row turning again to an outlet.

Growing community of inventors

Lake City, MN, United States of America

Maurice Francis Holahan