Vera

Qualitau, Inc.

Maurice C Evans

Vladimir Buzuev

Prakash Linga

Ajay Arora

Justin Sisley

Jens Ullmann

Adalberto M Ramirez

Robert J Sylvia

Peter P Cuevas

Nicolas Vautier

Gedaliahoo Krieger

Robert M Sikora

Jacob Herschmann

Jose Ysaguirre

Thomas G Bensing

Yongbum (Peter) Cuevas

Robert James Sylvia

Data security access and management may require a server dedicated to monitoring document access requests and enforcing rules and policies to limit access to those who are not specifically identified as having access to the data. One example of operation may include selecting data to access via a user device, applying at least one policy to the data that limits access to the data to user profiles assigned privileges to the policy, encrypting the data, generating metadata indicating the policy and pairing the metadata with the data, and storing the data and the metadata in a policy server.

Policy enforcement

Data security access and management may require a server dedicated to monitoring document access requests and enforcing rules and policies to limit access to those who are not specifically identified as having access to the data. One example of operation may include selecting data to be protected via a user device, applying at least one policy to the data, storing the at least one policy in a data record identifying the data, modifying a data format of the data to create a modified data, and storing the modified data in memory.

Securing files

Data security access and management may require a server dedicated to monitoring document access requests and enforcing rules and policies to limit access to those who are not specifically identified as having access to the data. One example of operation may include selecting data to access via a user device, identifying a user profile associated with the user device, retrieving at least one user policy associated with the user profile, determining whether the user policy permits the user device to access the data, matching the user policy to a data policy associated with the data, receiving an encryption key at the user device, applying the encryption key to the data, and unwrapping the data from a wrapped data format to access the data.

Access files

A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one 'well' location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).

High temperature ceramic die package and DUT board socket

A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A support frame includes a first portion which physically engages the first member and a second portion which physically engages the second member. A lever or handle is attached to the second portion and includes a cam surface for engaging a cam follower on the first portion for imparting relative lateral motion between the two members whereby the package leads physically engage wires of the second member.

High temperature open ended zero insertion force (ZIF) test socket

A pulsed current generator circuit for providing current pulses to a device under test includes a current source for applying a current to the device under test and a controlled current shunt for shunting current from the device under test. A booster circuit is provided for supplying a booster current to the device under test when the controlled current shunt is opened and current again flows through the device under test, thereby facilitating recharge of a parasitic capacitance associated with the device under test.

Pulsed current generator circuit with charge booster

A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A cam is provided for sliding the first member relative to the second member and moving leads extending through the holes in the first member into engagement with the contacts of the second member. A socket for dual in-line integrated circuit package (DIP) has two rows of holes in the first member, and two slots are provided in the second member each aligned with a row of holes. The wire contacts extend across each slot. For high temperature operation (greater than 250&deg; C.) the first and second members comprise anodized aluminum or a ceramic, and the wires comprise Monel or other high temperature material.

Growing community of inventors

Oakland, CA, United States of America

Maurice C Evans