Motorola Corporation

Honeywell International Inc.

Maureen Sugai

Joel LaBenz

Amer Aizaz

Theodore R Golubic

Ara Briley

David B Tornquist

Dave Tornquist

David J Pantier

Craig Kolb

Ed Kesner

Michael Kolic

Darrell Truhitte

Ralph L Dulay

A valve actuator includes an actuator housing, a piston, a linkage assembly, a magnet, and a Hall sensor. The actuator housing is adapted to receive pressurized fluid. The piston is movably mounted within actuator housing, and is configured to translate in a first direction and a second direction. The linkage assembly is rotationally coupled to the piston and is adapted to couple to a valve element. The linkage assembly is configured to rotate the valve element in a first rotational direction and a second rotational direction in response to piston movement in the first direction and the second direction, respectively. The magnet is mounted on the piston and is movable therewith, and the Hall sensor is mounted on the actuator housing and is responsive to movement of the magnet to supply a position signal.

Fluid actuated valve with hall position sensor

Methods and apparatus are provided for retaining a hinge shaft of a check valve with a bushing. The check valve includes a valve body defining a flow passage therethrough; a hinge shaft; a bushing coupled to the valve body and welded to the hinge shaft; and a closure element pivotally mounted on the hinge shaft for opening and closing the flow passage.

Check valves with hinge shafts retained by welding

A method for making and using a test fixture (10) for testing a packaged semiconductor device (44). The test fixture (10) includes a nonconductive housing (11) and a contactor assembly (30). The contactor assembly (30) has a contactor lead (31) and is removable from the housing (11). The contactor assembly (30) is mounted to the housing (11) such that the contactor lead (31) becomes interdigitated between upper cantilever structures (20) and lower cantilever structures (21). The test fixture (10) is coupled to a tester (46) which is between a first tool set (41) and a second tool set (42) of a trim and form apparatus (40). The packaged semiconductor device (44) is placed in contact with the test fixture (10) and tested.

Apparatus for coupling a semiconductor device with a tester

A method of forming leads and providing a final test of a semiconductor package including an electronic circuit therein, the package having unformed leads. A forming and testing station is provided including a support for receiving the package, and dies movably positioned adjacent the support for contacting and forming the leads with test equipment connected to the dies. The semiconductor package is positioned on the support, and the leads of the package are contacted with the dies to connect the test equipment to the leads for testing the electronic circuitry in the package and to form the leads with this contacting step as the final manufacturing step.

Process and apparatus for forming and testing semiconductor package leads

Method and apparatus for coupling a semiconductor device with a tester

An apparatus (19) for singulating a series of packages (17). The apparatus (19) includes a vertical wheel (12), a retainer spring (10), a gravity feed track (14), a pass track (15), and a reject track (16). The vertical wheel (12) comprises a plurality of slots (22-29), and rotates in a clockwise direction to deliver the packages (17) to an electrical test fixture (18). Upon completion of testing, the vertical wheel (12) rotates in a clockwise direction and delivers the packages (17) to either the pass track (15) or the reject track (16). A motor driven eccentric (37) actuates the retainer spring (10) to unblock the appropriate slot (22-29), thereby releasing the packages (17) from the appropriate slot (22-29).

Apparatus for singulating parts

A gravity fed culling apparatus (10) capable of singulating work pieces (12). The culling apparatus (10) comprises a transport track (11) and a rotating device (14) wherein the rotating device (14) has a first and a second protrusion (17 and 18, respectively) which cooperate with the transport track (11). A plurality of work pieces (12) are conveyed along the transport track (11) to an inspection site (13). After inspection, at least one work piece (12) is separated from the plurality of work pieces (12) and continues along the transport track (11).

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Phoenix, AZ, United States of America

Maureen Sugai