Growing community of inventors

Laguna Hills, CA, United States of America

Maureen R Brongo

Average Co-Inventor Count = 2.83

ph-index = 8

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 725

Maureen R BrongoBin Zhao (9 patents)Maureen R BrongoShao-Wen Hsia (4 patents)Maureen R BrongoHadi H Abdul-Ridha (3 patents)Maureen R BrongoDavid T Young (3 patents)Maureen R BrongoDavid Feiler (3 patents)Maureen R BrongoMichael J Berg (3 patents)Maureen R BrongoQizhi Liu (2 patents)Maureen R BrongoQ Z Liu (2 patents)Maureen R BrongoPhil N Sherman (2 patents)Maureen R BrongoD Morgan Tench (1 patent)Maureen R BrongoDieter Dornisch (1 patent)Maureen R BrongoJohn White (1 patent)Maureen R BrongoMaureen R Brongo (16 patents)Bin ZhaoBin Zhao (72 patents)Shao-Wen HsiaShao-Wen Hsia (5 patents)Hadi H Abdul-RidhaHadi H Abdul-Ridha (8 patents)David T YoungDavid T Young (5 patents)David FeilerDavid Feiler (4 patents)Michael J BergMichael J Berg (3 patents)Qizhi LiuQizhi Liu (197 patents)Q Z LiuQ Z Liu (9 patents)Phil N ShermanPhil N Sherman (4 patents)D Morgan TenchD Morgan Tench (31 patents)Dieter DornischDieter Dornisch (8 patents)John WhiteJohn White (5 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Newport Fab, LLC (8 from 294 patents)

2. Conexant Systems, Inc. (7 from 763 patents)

3. Rockwell Scientific Licensing LLC (1 from 44 patents)


16 patents:

1. 7109125 - Selective fabrication of high capacitance density areas in a low dielectric constant material

2. 7060557 - Fabrication of high-density capacitors for mixed signal/RF circuits

3. 7049246 - Method for selective fabrication of high capacitance density areas in a low dielectric constant material

4. 6984577 - Damascene interconnect structure and fabrication method having air gaps between metal lines and metal layers

5. 6836400 - Structures based on ceramic tantalum nitride

6. 6798065 - Method and apparatus for high-resolution in-situ plasma etching of inorganic and metals films

7. 6787911 - Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing

8. 6709564 - Integrated circuit plating using highly-complexed copper plating baths

9. 6627539 - Method of forming dual-damascene interconnect structures employing low-k dielectric materials

10. 6383821 - Semiconductor device and process

11. 6328848 - Apparatus for high-resolution in-situ plasma etching of inorganic and metal films

12. 6291361 - Method and apparatus for high-resolution in-situ plasma etching of inorganic and metal films

13. 6271127 - Method for dual damascene process using electron beam and ion implantation cure methods for low dielectric constant materials

14. 6251796 - Method for fabrication of ceramic tantalum nitride and improved structures based thereon

15. 6245663 - IC interconnect structures and methods for making same

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as of
12/17/2025
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