High Connection Density Inc.

Cornell University

Che-Yu Li & Company, LLC

Matti A Korhonen

Che-Yu Li

John David Williams

Zhineng Fan

Ai D Le

Weimin Shi

John G S Lahlouh

A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive metal or contains thermally conductive metal to provide heat-spreading or dissipation functions in addition to the function of the retention and alignment of the electrical contacts. The above interposer is used for chip attach for a single chip or a stack of chips in the package. The interposer provides electrical connections through individual electrical contact to another chip or to the substrate of the package. It provides also the heat spreading or dissipation function to the chips connected thermally to a particular interposer. The interposer can further be connected thermally to an external heat spreader when necessary.

High density electronic packages

The present invention provides a process for forming a contact member cable. The cable is a longer version of a contact member and can then be cut into shorter, individual contact members, to meet the particular requirements for a specific connector application. The contact members can be used as the conductive elements for a family of land grid array connectors that provide, among other things, a low profile, uniform electrical and mechanical performance, and reworkability if a contact member is damaged. The connectors are intended to interconnect electrical circuit members such as printed circuit boards, circuit modules, or the like. Such circuit members may be used in information handling system (computer) or telecommunications environments.

Method of forming a contact member cable

Wire segment based interposer for high frequency electrical connection

A low insertion force connection using two interfitting components: a tapered element and a beam element which is deformed by the tapered element in the region where the primary forces are buckling, rather than bending. The present invention is based on pressure engaged insert/receptacle type of connections that are self-assembling, and require a minimized insertion force to produce a high and tunable contact force that is not applied through the component to be attached. Apart from differences in size, the same design principles are applicable from the chip level to the board level of a microelectronic system. The invention comprises a low cost pressure engaged electrical and thermal connection, based on insert/receptacle structures in which the contact force and insertion force are separated. Such a design allows tunable contact force while it minimizes the insertion force and allows also for self-assembly and reworkability. They can readily be used in area array configurations and in conformal 3-D electronic packaging structures in all connection levels of a microelectronic system.

Self-assembled low-insertion force connector assembly

Growing community of inventors

Ithaca, NY, United States of America

Matti A Korhonen