Tdk Corporation

Infineon Technologies Ag

Epcos Ag

Intermedics Inc.

Matthias Schmidt

Matthias König

Joachim Mahler

Eckhard U Alt

Thomas Fischer

Hermann Gruber

Lawrence J Stotts

Uwe Hoeckele

Anton Prueckl

Andreas Barbul

Markus Mayr

Patrick Scheele

A sensor device and an electronic assembly are disclosed. In an embodiment a sensor device includes a first pellistor element, a second pellistor element, a heater element, a first temperature sensor element and a second temperature sensor element, wherein the heater element and the first temperature sensor element are part of the first pellistor element and the heater element and the second temperature sensor element are part of the second pellistor element.

Sensor device and electronic assembly

In an embodiment A package includes a casing having an opening and enclosing a cavity, a die accommodated in the cavity and a membrane attached to the casing, the membrane being air-permeable, covering and sealing the opening, wherein the membrane is configured to allow only a lateral gas flow, and wherein a blocking member is configured to block a vertical gas flow through the membrane into the cavity, the blocking member tightly covering a surface of the membrane at least in an area comprising the opening.

Packaged die and assembling method

In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate. A bond layer is disposed between the substrate and the dielectric liner layer.

Semiconductor packages and methods of formation thereof

A circuit provided for impedance matching includes an input, an output and four impedance elements arranged between them. In this case, two of the impedance elements are connected in series in a main path and form a T configuration with a third component. In addition, a fourth component is connected in parallel with the main path of the circuit. By way of example, the components arranged in the main path are variable capacitances and the further components are inductances.

Circuit for impedance matching

A variable rate cardiac pacemaker is adapted to be implanted in a human patient for automatically adapting pacing rate to metabolic need of the patient when the patient is walking in an ascending path, a descending path, or on a level plane. An accelerometer senses the activity of the patient walking, and produces an electrical sensor signal representative of the activity. The accelerometer signal has variable parameters indicative of morphology, including amplitude, of the sensor signal according to status of activity of the patient and to the upward, downward, or horizontal direction of the patient's walking. A pulse generator generates pacing pulses at a variable rate according to an applied control signal to electrically stimulate the patient's heart at a pacing rate which varies according to patient activity. A processing and control circuit of the pacemaker processes the sensor signal for detecting differences in the signal morphology attributable to whether the patient is walking on an ascending path, a descending path, or a level path, irrespective of the presence or absence of disparity in the amplitude of the sensor signal resulting from walking along the respective path. The latter circuit also develops the control signal to dictate a basic pacing rate from the amplitude of the sensor signal, and an enhanced rate more appropriate to the metabolic need of the patient from the detected differences in morphology of the sensor signal, for application to the pulse generator.

Accelerometer-based rate-adaptive cardiac pacing with second generation

Growing community of inventors

Munich, Germany

Matthias Schmidt