Nxp B.v.

Ams International Ag

Sapiens Steering Brain Stimulation B.v.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Quotainne Enterprises LLC

Matthias Merz

Youri Victorovitch Ponomarev

Aurelie Humbert

Roel Daamen

Gilberto Curatola

Romano Hoofman

Axel Nackaerts

Dimitri Soccol

David Tio Castro

Mark Van Dal

Marcus Johannes Henricus Van Dal

Remco Henricus Wilhelmus Pijnenburg

Coenraad Cornelis Tak

Remco H W Pijnenburg

Casper Juffermans

Remco Hw Pijnenburg

Marcus Van Dal

Remco Pijnenburg

Fotopoulou Kyriaki

Anton Tombeur

Disclosed is an integrated circuit comprising a substrate () carrying a plurality of circuit elements; a metallization stack () interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion () and a second metal portion (); a passivation stack () covering the metallization stack; a gas sensor including a sensing material portion () on the passivation stack; a first conductive portion () extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion () extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an IC is also disclosed.

Integrated circuit with sensor and method of manufacturing such an integrated circuit

A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.

Food package with integrated RFID-tag and sensor

Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.

Semiconductor device and method including an intertial mass element

Disclosed is a pH and conductivity sensor including a carrier comprising a plurality of conductive tracks and an exposed conductive area defining a reference electrode connected to a first track of said plurality of conductive tracks, a sensing device mounted on the carrier and connected to at least a second track of said plurality of conductive tracks, the sensing device including an exposed surface that is sensitive to Hconcentrations, and a plurality of electrodes adjacent to the exposed surface, an encapsulation covering the carrier, said encapsulation including a first cavity exposing a surface of the sensing device, and a second cavity exposing the exposed conductive area.

Integrated pH and conductivity sensor and manufacturing method thereof

Disclosed is an integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.

Integrated circuit and manufacturing method therefor

Disclosed is an integrated circuit comprising a substrate () carrying plurality of circuit elements (); a plurality of sensing electrodes () over said substrate, each sensing electrode being electrically connected to at least one of said circuit elements; and a plurality of wells () for receiving a sample, each sensing electrode defining the bottom of one of said wells, wherein each sensing electrode comprises at least one portion (') extending upwardly into said well. A method of manufacturing such an IC is also disclosed.

Integrated circuit with sensors and manufacturing method

A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other.

Sensor

An electrochemical sensor for sensing a target substance is disclosed. In one example, the sensor discloses an electrolyte matrix, wherein the matrix reposits an electrolyte; a working electrode coupled to the electrolyte matrix at a first location; a counter electrode coupled to the electrolyte matrix at a second location; an electrical circuit, coupled to the working electrode and the counter electrode, and capable of generating an output signal in response to an electrical current which flows between the working electrode and the counter electrode in response to a presence of the target substance.

Electrochemical sensor

There is disclosed an electrochemical sensor device comprising: an integrated electrochemical sensor element having: a substrate; first and second electrodes formed on the upper surface of the substrate; and an electrolyte layer formed on the first and second electrodes so as to electrically contact both the first and second electrodes; and a sensor integrated circuit electrically connected to the first and second electrodes of the integrated electrochemical sensor element. The integrated electrochemical sensor element and the sensor integrated circuit are provided in a single package.

Electrochemical sensor device

A biocompatible electrode is manufactured by depositing filling metaland etching back the filling metal to the surface of the surrounding insulator. Then, a further etch forms a recessat the top of the via. An electrode metalis then deposited and etched back to fill the recessand form biocompatible electrode. In this way, a planar biocompatible electrode is achieved. The step of etching to form the recess may be carried out in the same CMP tool as is used to etch back the filling metal. A hydrogen peroxide etch may be used.

Biocompatible electrodes and methods of manufacturing biocompatible electrodes

Disclosed is an integrated circuit comprising a substrate () carrying plurality of circuit elements (); a metallization stack () over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers () spatially separated from each other by respective electrically insulating layers (), at least some of said electrically insulating layers comprising conductive portions () that electrically interconnect portions of adjacent metal layers, wherein at least one of the patterned metallization layers comprises a plurality of ion-sensitive electrodes (), each ion-sensitive electrode being electrically connected to at least one of said circuit elements, a plurality of sample volumes () extending into said metallization stack, each sample volume terminating at one of said ion-sensitive electrodes; and an ion-sensitive layer lining at least the ion-sensitive electrodes in said sample volumes. A method of manufacturing such an IC is also disclosed.

Integrated circuit with ion sensitive sensor and manufacturing method

A detector device comprises a substrate (), a source region (S) and a drain region (D), and a channel region () between the source and drain regions. A nanopore () passes through the channel region, and connects fluid chambers () on opposite sides of the substrate. A voltage bias is provided between the fluid chambers, the source and drain regions and a charge flow between the source and drain regions is sensed. The device uses a nanopore for the confinement of a sample under test (for example nucleotides) close to a sensor. The size of the sensor can be made similar to the spacing of adjacent nucleotides in a DNA strand. In this way, the disadvantages of PCR based techniques for DNA sequencing are avoided, and single nucleotide resolution can be attained.

Apparatus and method for molecule detection using nanopores

The invention provides an implantable multi-electrode device () and related methods and apparatuses. In one embodiment, the invention includes an implantable device () comprising: an assembly block (); and a plurality of leads () radiating from the assembly block (), each of the plurality of leads () containing at least one electrode (A), such that the electrodes are distributed within a three-dimensional space, wherein the assembly block () includes a barb () for anchoring the assembly block () within implanted tissue.

Implantable multi-electrode device

The invention relates to an electronic device for measuring and/or controlling a property of an analyte (). The electronic device comprises: i) an electrode (Snsr) forming an interface with the analyte () in which the electrode (Snsr) is immersed in operational use, the interface having an interface temperature (T), and ii) a resistive heater (Htr) being thermally and capacitively coupled to the electrode (Snsr), the resistive heater (Htr) being configured for setting the interface temperature (T) by controlling a current through the resistive heater (Htr). The resistive heater (Htr) is provided with signal integrity protection for reducing the capacitive charging of the electrode (Snsr) by the resistive heater (Htr) if the current through the resistive heater (Htr) is modulated. The invention further relates to an electrochemical sensor for determining a charged particle concentration in the analyte () using the thermo-potentiometric principle, the electrochemical sensor comprising such electronic device. The invention also relates to an RFID tag and a semiconductor device comprising such electrochemical sensor. The effect of the feature of the invention is that the capacitive charging effect between the resistive heater and the electrode is reduced by the signal integrity protection.

Reducing capacitive charging in electronic devices

Disclosed is a liquid immersion sensor comprising a substrate () carrying a conductive sensing element () and a corrosive agent () for corroding the conductive sensing element, said corrosive agent being immobilized in the vicinity of the conductive sensing element and being soluble in said liquid.

Growing community of inventors

Leuven, Belgium

Matthias Merz