Hymite A/s

Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC Solid State Lighting Ltd.

Matthias Heschel

Jochen Kuhmann

Thomas Murphy

Kristian Blidegn

Andreas Alfred Hase

Jorgen Hoeg

Arnd Kilian

Lior Shiv

Jochen Friedrich Kuhmann

Christoffer Graae Greisen

Steen Weichel

A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.

Package for a light emitting element

A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization.

Fabrication process for package with light emitting device on a sub-mount

Formation of a structure with through-holes includes attaching two sub-structures to one another. The resulting structure may be used in a sub-assembly for various types of micro components and may serve as a lid or base of a housing that encapsulates one or more micro components. The techniques may provide greater flexibility in the shape of the through-holes and may reduce costs compared with other known techniques.

Method of forming an assembly to house one or more micro components

A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads.

Method of fabrication for chip scale package for a micro component

Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.

Hermetically sealed package for optical, electronic, opto-electronic and other devices

The substrate includes an alignment slot in at least one of its side edges, and includes metallization coupled electrically to the micro component and extending from the front surface of the substrate to its back surface via at least one of the alignment slots. The assembly also includes a cover attached to the substrate so as to encapsulate the micro component. The cover includes at least one protrusion on its underside such that each protrusion mates with a respective alignment slot in the side edges of the substrate.

Assembly with self-alignment features to position a cover on a substrate that supports a micro component

An optical structure includes a substrate for receiving an optical device. The substrate may hold waveguide reference surfaces for vertical alignment of the device to a waveguide core of the substrate. A carrier for holding the optical device has contact surface parts for holding the optical device and for mounting the carrier to an optical device receiving substrate.

Optical device receiving substrate and optical device holding carrier

Double-sided etching techniques are disclosed for providing a semiconductor structure with one or more through-holes. The through-holes may be sealed hermetically such as by a feed-through metallization process. The feed-through metallization process may provide electrical contact to an opto-electronic or integrated circuit encapsulated in a package with the semiconductor structure used as a lid.

Double-sided etching technique for semiconductor structure with through-holes

Semiconductor structures with one or more through-holes are disclosed. A feed-through metallization process may be used to seal the through-holes hermetically.

Semiconductor structures having through-holes sealed with feed-through metalization

Double-sided etching techniques are disclosed for providing a semiconductor structure with one or more through-holes. The through-holes may be sealed hermetically such as by a feed-through metallization process. The feed-through metallization process may include using an electroplating technique and may provide electrical contact to an opto-electronic or integrated circuit encapsulated in a package with the semiconductor structure used as a lid.

Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes

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Rodovre, Denmark

Matthias Heschel