Solarworld Innovations Gmbh

Qimonda Ag

Solarworld Industries Gmbh

Matthias Georgi

Olaf Storbeck

Martin Kutzer

Harald Hahn

Holger Neuhaus

Harry Hedler

Andreas Wolter

Marc Dietrich

Bernd Bitnar

Matthias Schaarschmidt

Thomas Seidel

Thilo Richter

Wolfgang Enger

Michael Wolf

Paul Grunow

In various embodiments, a single-pole switching unit for limiting the energy flow in a series circuit having photovoltaic modules by a pulsating control signal present on at least one DC line is provided. The switching unit may include: a switching element, which is designed to reduce the current flow in the at least one DC line of the photovoltaic modules; a transmission element, which is designed to couple out an electrical control signal present on the DC line and to control the switching element merely with the energy of the coupled-out control signal; and a coupling element, which is arranged in parallel with the switching element and which conducts the control signal through the switching unit when the switching element is nonconducting.

Single-pole switching unit for limiting the energy flow in a series circuit comprising photovoltaic modules, photovoltaic module arrangement and photovoltaic module

In different exemplary embodiments, a solar cell is provided, including: a substrate with a first region and a second region, wherein the first region includes at least a first electrical conductivity and the second region includes at least a second electrical conductivity which is greater than the first electrical conductivity; and a passivation on the surface of the substrate; and a contact-structure on the surface of the substrate, wherein the contact-structure includes a plurality of contacts; wherein two contacts of the plurality of contacts are disposed at a first distance with respect to each other in the first region; wherein two further contacts of the plurality of contacts are disposed at a second distance with respect to each other in the second region; and wherein the second distance is greater than the first distance.

Solar cell and method of manufacturing

The present invention relates to a process for producing a solar module comprising one or more solar cell(s) encapsulated in a polymer matrix, wherein the process comprises applying a matrix composition to one or more solar cell(s) such that the one or more solar cell(s) is/are surrounded by a continuous layer of matrix composition and polymerizing the matrix composition in order to form a polymer matrix encapsulating the one or more solar cell(s), wherein the matrix composition is a structurally viscous liquid which comprises a polymerizable compound for forming the matrix and has a yield point, and to the thus obtainable solar modules.

Process for encapsulating a solar cell in a polymer matrix

A method for contacting and connecting solar cells, according to which at least one electrode is formed by at least one wire conductor, and including the following steps:

Method for contacting and connecting solar cells

An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell.

Photovoltaic cell electrode and method for electrically connecting a photovoltaic cell

Integrated circuit assembly including a die stack assembly having a heat dissipation device thermally coupled to a lateral of surface the die stack assembly. The die stack assembly includes a plurality integrated circuits placed on each other. In another embodiment a heat dissipation device comprising an encapsulant is thermally coupled to and surrounds a die stack assembly that includes a plurality of integrated circuits placed on each other. At least one heat conducting intermediate layer between integrated circuits is thermally coupled to the heat dissipation device.

Integrated circuit package with a heat dissipation device

Growing community of inventors

Dresden, Germany

Matthias Georgi