Infineon Technologies Ag

Matthias Eberl

Franz Jost

Stefan Kolb

Rainer Markus Schaller

Klaus Elian

Fabian Merbeler

Horst Theuss

Simon Gassner

Christoph Steiner

Emanuel Stoicescu

Jochen Dangelmaier

Michael Kandler

Costin Batrinu

Jens G Pohl

Franz Michael Darrer

Christian Bretthauer

Ludwig Heitzer

Maximilian Werner

Cyrus Ghahremani

Emanuele Bruno Bodini

Derek Debie

Andreas Allmeier

Thomas Engl

Francesco Solazzi

Manfred Eder

Christian Irrgang

Julia Isabel Perez Barraza

Ilie Poenaru

Thomas Müller

Thomas Albrecht

Mohanraj Soundara Pandian

A gas sensor comprises a sensor element for the detection of a gas, an encapsulation, which surrounds the sensor element and has an opening for a gas to be detected to pass through to the sensor element, and a flame arrester, which is arranged in the opening of the encapsulation.

Gas sensor with a sensor element and a flame arrester and use of the same for the detection of gases

The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.

Semiconductor device for particle measurement and method for operating the semiconductor device

An ultrasonic touch sensor includes a touch structure having a touch surface with a plurality of sensitive areas, a pixel array of capacitive ultrasonic transducers, and a sensor circuit. Each pixel includes a respective ultrasonic transmitter and a respective ultrasonic receiver and is configured to monitor for a touch at a respective first sensitive area and at a respective second sensitive area. Moreover, each pixel is configured to generate a measurement signal that is representative of a first respective ultrasonic reflected wave reflected by the touch interface at the respective first sensitive area or that is representative of a second respective ultrasonic reflected wave reflected by the touch interface at the respective second sensitive area. The sensor circuit is configured to determine whether the measurement signal of a respective pixel corresponds to the respective first sensitive area or to the respective second sensitive area associated with the respective pixel.

Capacitive micromachined ultrasonic transducer (CMUT) multi-touch and slider detection with improved pixel area coverage and ultrasonic feedback by a same pixel array

A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

Photoacoustic sensors and MEMS devices

It is proposed a sensor for measuring a gas property, wherein the sensor comprises a semiconductor die, wherein the semiconductor die comprises a reference cavity and a measuring cavity, wherein a reference sensor element is arranged in the reference cavity, wherein a measuring sensor element is arranged in the measuring cavity, wherein the reference cavity is sealed from ambient gas, wherein the measuring cavity is fluidly connected to ambient gas. Further it is proposed a method for manufacturing such a sensor.

Sensor for measuring a gas property

A gas sensor comprises a membrane, a first plate arranged on a first side of the membrane and having through openings for the passage of a gas, a second plate arranged on a second side of the membrane, the second side being situated opposite the first side, and an electronic circuit, which is connected to the membrane, the first plate and the second plate and causes the membrane to emit ultrasonic radiation, and which is configured to determine a resonant frequency of the ultrasonic radiation.

Gas sensor containing an ultrasonic resonator and use for the detection of gases

An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

Ultrasonic transducer

A gas sensor includes a hollow space, a gas permeation structure which is arranged between the hollow space and the exterior space and contains a selectively gas-permeable element, wherein the hollow space is hermetically sealed with the exception of the gas permeation structure, and one or more sensor elements which are configured for detecting the presence of one or more gases in the hollow space.

Gas sensor having a hollow space and a gas permeation structure having a selectively gas-permeable element

A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.

Integration of a sensor system in a casing

A method of communicating with a tire pressure monitoring system (TPMS) sensor module includes transmitting, by the TPMS sensor module, a TPMS signal that includes a sensor identifier of the TPMS sensor module; performing, by an interface device, an angle of arrival measurement on the TPMS signal to whether an angular direction thereof with respect to an antenna array of the interface device is within a predetermined angular window; and determining, by the interface device, whether or not to communicate with the TPMS sensor module including establishing communication with the TPMS sensor module on a condition that the angular direction is within the predetermined angular window and not establishing communication with the TPMS sensor module on a condition that the determined angular direction is not within the predetermined angular window.

Selection of Tire Pressure Monitoring System (TPMS) sensor modules for radio-frequency (RF) communication by angle detection

A touch sensor includes a touch structure including a touch interface and an inner interface arranged opposite to the touch interface; a capacitive ultrasonic transmitter arranged inside an enclosed interior volume and configured to transmit an ultrasonic transmit wave towards the touch structure; a capacitive ultrasonic receiver arranged inside the enclosed interior volume and configured to receive at least one ultrasonic reflected wave produced from the ultrasonic transmit wave via internal reflection; a coupling medium that fills an area between the inner interface and the capacitive ultrasonic receiver, wherein an external force applied to the touch interface is configured to impart an internal pressure onto the capacitive ultrasonic receiver through the coupling medium; and a sensor circuit configured to convert the at least one ultrasonic reflected wave into a measurement signal and detect the external force based on the measurement signal.

Ultrasonic touch sensors and capacitive pressure sensing microelectromechanical system fusion

A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

Photoacoustic detector unit, photoacoustic sensor and associated production methods

A touch sensor includes: a transmitter configured to transmit an ultrasonic transmit wave towards a touch structure; a receiver configured to receive an ultrasonic reflected wave produced from the ultrasonic transmit signal being at least partially reflecting by the touch structure; a receiver circuit configured to convert the ultrasonic reflected wave into a measurement signal; the receiver circuit configured to generate an error value representative of a difference between a measured value of the measurement signal and a reference value; a programmable voltage source configured to provide a bias voltage to the transmitter or to the receiver; a controller configured to adjust the bias voltage based on the error value; a measurement circuit configured to measure the DC bias voltage and determine whether a no-touch event or a touch event has occurred at the touch structure based on at least one measurement of the bias voltage.

Ultrasonic touch sensor with active feedback

An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.

Growing community of inventors

Taufkirchen, Germany

Matthias Eberl