Robert Boschgmbh

Matthias Boehringer

Hubert Benzel

Stefan Pinter

Frieder Haag

Torsten Kramer

Matthias Illing

Simon Armbruster

Simon Ambruster

A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated.

Method for producing a plurality of chips and a chip produced accordingly

A method for manufacturing chips (), in which at least one diaphragm () is produced in the surface layer of a semiconductor substrate () spanning a cavity (). The functionality of the chip () is then integrated into the diaphragm (). In order to separate the chip (), the diaphragm () is detached from the substrate composite. The method according to the present invention is characterized by metal plating of the back of the chip () in an electroplating process before the chip is separated.

Method for manufacturing chips

Growing community of inventors

Reutlingen, Germany

Matthias Boehringer