Bruker Technologies Ltd.

Bruker Jv Israel Ltd.

Jordan Valley Semiconductors Ltd.

Bede Scientific Instruments Limited

Jordan Valley Semiconductor Ltd

Matthew Wormington

Isaac Mazor

Alexander Krokhmal

Alex Dikopoltsev

Yuri Vinshtein

Boris Yokhin

David Berman

Asher Peled

John Leonard Wall

Paul Anthony Ryan

Alex Tokar

Alexander Krohmal

Gennady Openganden

Amos Gvirtzman

Nikolai Kasper

Ladislav Pina

David Keith Bowen

Alex Krokhmal

Dor Perry

Adam Ginsburg

Alexander Brandt

Oliver Whear

Alex Brandt

Richard Thake Bytheway

Ayelet Dag

Bagrat Khachatryan

Guy Sheaffer

David Jacques

Richard Bytheway

Kevin Monroe Matney

Juliette P M Van Der Meer

Petra Feichtinger

Elad Yaacov Schwarcz

Mark James Vermeulen

A system includes first and second imaging assemblies, and a processor. The first imaging assembly is configured to produce a first image of a measurement site in a sample. The second imaging assembly is coupled with a measurement assembly and is configured to produce a second image of the measurement site. The processor is configured to: (i) perform, based on the first image, a first movement of the sample relative to the measurement assembly, (ii) perform, based on the second image, a second movement of the sample for aligning the sample with the measurement assembly, and (iii) control the measurement assembly to perform a measurement in the measurement site.

Navigation accuracy using camera coupled with detector assembly

A method for evaluating a sample that includes an array of structural elements. The method includes obtaining a first small angle x-ray scattering (SAXS) pattern for a first angular relationship between the sample and an x-ray beam that exhibits a first collimation value and has a given cross-sectional area on a first side of the sample. A second SAXS pattern is obtained for a second angular relationship between the sample and the x-ray beam, while the x-ray beam exhibits a second collimation value that differs from the first collimation value while maintaining the given cross-sectional area of the x-ray beam on the first side of the sample, wherein the second angular relationship differs from the first angular relationship.

Small-angle X-ray scatterometry

A method for X-ray measurement includes generating and directing an X-ray beam to a sample including at least first and second layers stacked on one another, the X-ray beam incident on a sample location at which the first and second layers include respective first and second high aspect ratio (HAR) structures. X-ray scatter profiles are measured, that are emitted from the sample location in response to the X-ray beam as a function of tilt angle between the sample and the X-ray beam. A shift is estimated, between the first and second layers and a characteristic tilt of the first and second layers, based on the X-ray scatter profiles measured as a function of the tilt angle.

Transmission X-ray critical dimension (T-XCD) characterization of shift and tilt of stacks of high-aspect-ratio (HAR) structures

A method for evaluating an array of high aspect ratio (HAR) structures on a sample includes illuminating the sample with an x-ray beam along a first axis parallel to within two degrees to the HAR structures in the array and sensing a first pattern of small angle x-ray scattering (SAXS) scattered from the sample while illuminating the sample along the first axis. The sample is illuminated with the x-ray beam along a second axis that is oblique to the HAR structures in the array, and a second pattern of the SAXS scattered from the sample is sensed while illuminating the sample along the second axis. Information is extracted with respect to the HAR structures based on the first and second patterns.

Small-angle x-ray scatterometry

An x-ray apparatus, that may include a mount that is configured to hold a sample; an x-ray source, that is configured to direct an x-ray beam toward a first side of the sample; a detector, positioned downstream to a second side of the sample, the detector is configured to detect, during a sample measurement period, at least a part of x-rays that have been transmitted through the sample; and an x-ray intensity detector that is positioned, during a beam intensity monitoring period at a measurement position that is located between the x-ray source and the first side of the sample, so as to detect at least a part of the x-ray beam before the x-ray beam reaches the sample.

An X-ray apparatus includes a mount, an X-ray source, a detector, an optical gauge and a motor. The mount is configured to hold a planar sample having a first side, which is smooth, and a second side, which is opposite the first side and on which a pattern has been formed. The X-ray source is configured to direct a first beam of X-rays toward the first side of the sample. The detector is positioned on the second side of the sample so as to receive at least a part of the X-rays that have been transmitted through the sample and scattered from the pattern. The optical gauge is configured to direct a second beam of optical radiation toward the first side of the sample, to sense the optical radiation that is reflected from the first side of the sample, and to output a signal, in response to the sensed optical radiation, that is indicative of a position of the sample. The motor is configured to adjust an alignment between the detector and the sample in response to the signal.

Wafer alignment for small-angle x-ray scatterometry

An X-ray apparatus includes a mount, an X-ray source, a detector, an actuator, and a controller. The mount is configured to hold a sample. The X-ray source is configured to direct a beam of X-rays toward a first side of the sample. The detector is positioned on a second side of the sample, opposite the first side, so as to receive at least a portion of the X-rays that have been transmitted through the sample and to output signals indicative of an intensity of the received X-rays. The actuator is configured to scan the detector over a range of positions on the second side of the sample so as to measure the transmitted X-rays as a function of a scattering angle. The controller is coupled to receive the signals output by the detector and to control the actuator, responsively to the signals, so as to increase an acquisition time of the detector at first positions where the intensity of the received X-rays is weak relative to the acquisition time at second positions where the intensity of the received X-rays is strong.

X-ray detection optics for small-angle X-ray scatterometry

An X-ray apparatus includes a mount, an X-ray source, a detector and a beam limiter. The mount is configured to hold a planar sample. The X-ray source is configured to direct a beam of X-rays toward a first side of the sample. The detector is positioned on a second side of the sample, opposite the first side, so as to receive at least a part of the X-rays that have been transmitted through the sample. The beam limiter is positioned on the first side of the sample so as to intercept the beam of the X-rays. The beam limiter includes first and second blades and first and second actuators. The first and second blades have respective first and second edges positioned in mutual proximity so as to define a slit, through which the beam of the X-rays will pass, at a distance smaller than 25 mm from the first side of the sample. The first and second actuators are configured to shift the first and second blades along respective, first and second translation axes so as to adjust a width of the slit.

X-ray source optics for small-angle X-ray scatterometry

A system for X-ray topography, the system includes a source assembly, a detector assembly, a filter and a processor. The source assembly is configured to direct at least an X-ray beam to impinge, at an angle, on a first surface of a sample, the X-ray beam is divergent when impinging on the first surface. The detector assembly is configured to detect the X-ray beam that had entered the sample at the first surface, diffracted while passing through the sample and exited the sample at a second surface that is opposite to the first surface, and to produce an electrical signal in response to the detected X-ray beam. The filter is mounted between the source assembly and the first surface, and is configured to attenuate an intensity of a selected spectral portion of the X-ray beam. The processor is configured to detect one or more defects in the sample based on the electrical signal.

Image contrast in X-ray topography imaging for defect inspection

An apparatus for X-ray measurement, includes an X-ray source, an X-ray detector, an optical inclinometer, and a processor. The X-ray source is configured to generate and direct an X-ray beam to be incident at a grazing angle on a surface of a sample. The X-ray detector is configured to measure X-ray fluorescence emitted from the surface of the sample in response to being excited by the X-ray beam. The optical inclinometer is configured to measure an inclination of the surface of the sample. The processor is configured to calibrate the grazing angle of the X-ray beam based on the measured inclination, and to further fine-tune the grazing angle based on the X-ray fluorescence measured by the X-ray detector.

X-ray fluorescence apparatus for contamination monitoring

Apparatus for X-ray scatterometry includes an X-ray source, which directs an X-ray beam to be incident at a grazing angle on an area of a surface of a sample, and an X-ray detector measures X-rays scattered from the area. A knife edge is arranged parallel to the surface of the sample in a location adjacent to the area so as to define a gap between the surface and the knife edge and to block a portion of the X-ray beam that does not pass through the gap. A motor moves the knife edge perpendicular to the surface so as to control a size of the gap. An optical rangefinder receives optical radiation reflected from the surface and outputs a signal indicative of a distance of the knife edge from the surface. Control circuitry drives the motor responsively to the signal in order to regulate the size of the gap.

Closed-loop control of X-ray knife edge

A method for X-ray measurement includes, in a calibration phase, scanning a first X-ray beam, having a first beam profile, across a feature of interest on a calibration sample and measuring first X-ray fluorescence (XRF) emitted from the feature and from background areas of the calibration sample surrounding the feature. Responsively to the first XRF and the first beam profile, a relative emission factor is computed. In a test phase, a second X-ray beam, having a second beam profile, different from the first beam profile, is directed to impinge on the feature of interest on a test sample and second XRF emitted from the test sample is measured in response to the second X-ray beam. A property of the feature of interest on the test sample is computed by applying the relative emission factor together with the second beam profile to the measured second XRF.

Measurement of small features using XRF

An apparatus for X-ray topography includes a source assembly, a detector assembly, a scanning assembly and a processor. The source assembly is configured to direct multiple X-ray beams so as to irradiate multiple respective regions on a sample, wherein the regions partially overlap one another along a first axis of the sample and are offset relative to one another along a second axis of the sample that is orthogonal to the first axis. The detector assembly is configured to detect the X-ray beams diffracted from the sample and to produce respective electrical signals in response to the detected X-ray beams. The scanning assembly is configured to move the sample relative to the source assembly and the detector assembly along the second axis. The processor is configured to identify defects in the sample by processing the electrical signals, which are produced by the detector assembly while the sample is moved.

Using multiple sources/detectors for high-throughput X-ray topography measurement

An apparatus includes an X-ray tube, X-ray optics, one or more coils and control circuitry. The X-ray tube is configured to direct an electron beam onto an anode so as to emit an X-ray beam. The X-ray optics which configured to receive the X-ray beam emitted from the X-ray tube and to direct the X-ray beam onto a target. The coils are configured to steer the electron beam in the X-ray tube using electrical currents flowing through the coils. The control circuitry is configured to compensate for misalignment between the X-ray tube and the X-ray optics by analyzing the X-ray beam output by the X-ray optics, and setting the electrical currents based on the analyzed X-ray beam.

X-ray source assembly

Apparatus, including a sample-support that retains a sample in a plane having an axis, the plane defining first and second regions separated by the plane. A source-mount in the first region rotates about the axis, and an X-ray source on the source-mount directs first and second incident beams of X-rays to impinge on the sample at first and second angles along beam axes that are orthogonal to the axis. A detector-mount in the second region moves in a plane orthogonal to the axis and an X-ray detector on the detector-mount receives first and second diffracted beams of X-rays transmitted through the sample in response to the first and second incident beams, and outputs first and second signals, respectively, in response to the received first and second diffracted beams. A processor analyzes the first and the second signals so as to determine a profile of a surface of the sample.

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Matthew Wormington