Sandia Corporation

Adv Antest Corporation

Matthew W Losey

Albert Alec Talin

Ira Leventhal

John William Andberg

Erik H Volkerink

Stewart K Griffiths

Lakshmikanth Namburi

Yohannes Desta

Dawn M Skala

John T Hachman

Sanjeev Grover

Vincent E Lopopolo

Dorrance E McLean

Georg Aigeldinger

Chu-Yeu Peter Yang

Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel 'split-cartridge' design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A 'probe-card stops' design may be used within the cartridge to simplify the overall cartridge design and operation.

Method and apparatus for massively parallel multi-wafer test

A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

Apparatus and method for electroforming high aspect ratio micro-parts

The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.

Vitreous carbon mask substrate for X-ray lithography

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Livermore, CA, United States of America

Matthew W Losey