Input/output, Inc.

I/o Sensors, Inc.

Triton Technologies, Inc.

Protell Systems International, Inc.

Idn Geophysical Corporation

Matthew W Ip

Duli Yu

Howard D Goldberg

Arjun Selvakumar

James L Marsh

Martin Arnold Schmidt

Bing-Fai Fung

Philip Simon

W S Henrion

Raymond K Erickson

André W Olivier

Lianzhong Yu

Peter Maxwell

Axel Michael Sigmar

Lawrence Philip Behn

Thomas M Buie

Franklin W Mayo

Burton A Devolk

Guido Lemke

W Marc Stalnaker

Ray Rinne

Demetrios Balderes

Adam G Kay

Klaus Domagalski

David Morgan

Kees Faber

Sjoerd Altman

Richard Laroo

Larry Rushefsky

Hubert R Plumlee

Christopher A Grubbs

Bing F Fung

An underwater ocean bottom cable constructed of a series of axially aligned cable segments alternately arranged with sensor units. The sensor units include an outer housing with an interior cavity in which a sensor module is suspended by a cradle. Vanes on the sensor module protrude through axially elongated openings in the outer housing to dig into the seabed to provide good seismic coupling between the seabed and pressure sensors and motion sensors housed in the sensor module. The outer sensor housing is split into complementary portions that clamp firmly onto the ends of adjacent cable segments. Stress members, such as high modulus fiber ropes, extend out the ends of adjacent cable segments. Axial channels formed in the intervening outer sensor housing on opposite sides of the sensor module receive the stress members, which, along with the cradle, provide seismic isolation between the cable segments and the sensor modules.

Ocean bottom cable and sensor unit

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

Sensor design and process

A sensor apparatus () includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module () supported by a planar surface () within a cavity () of a housing () coupled to a first end cap () by a PC-board connection (). Housing () is further coupled to first end cap () by a first coupling member () and a second coupling member () and is also coupled to an opposite second end cap () by a third coupling member () and a fourth coupling member (). Interface sealing members () seal between housing () and first end cap (). Interface sealing members () seal between housing () and second end cap ().

Integrated and multi-axis sensor assembly and packaging

A highly sensitive silicon micro-machined sensor package is provided for use in a micro-g environment that can also resist high shock in excess of 5000 g. The sensor is provided to measure acceleration in cooperation with associated electronics which are required to have electrical contact with sensor elements. The sensor is sealed in a high vacuum environment, and is arranged and designed to be free of temperature induced stress to the sensor. The sensor die package assembly comprises a silicon micro-machined sensor die, a ceramic package, two contact springs, a shorting clip, solder preform, a metal lid and a getter foil for ensuring a good vacuum for an extended period. The sensor die comprises a moving mass with eight supporting flexures on both sides of the proof mass. The proof mass's movement is protected on both sides by a top and a bottom cap. Acceleration applied to the package and the die causes the proof mass to move vertically in relation with the adjacent caps. The changes in distance between the proof mass and the caps in turn generate a change in an electrical signal which corresponds to the capacitance changes between the gaps. The sensor die package arrangement provides that the sensor die be secured within an evacuated ceramic case. Electrical connections made between external contacts of the case and contacts of the sensor die within the case are made through conductive springs, thereby minimizing materials in the interior of the case which would outgass in the vacuum environment.

Sensor package arrangement

Apparatus for measuring a characteristic of motion and methods for its manufacture are disclosed in which a sensor structure includes a support structure, and a mass suspended from such support structure by a spring connecting arrangement and electrical devices for measuring displacement of the mass which results from a force applied to the support structure. An apparatus is provided where the mechanical spring constant of the connecting arrangement of the sensor structure is provided to be a high value representative of a strong, stiff spring which resists breaking due to high forces applied to it, and where an electric spring constant is provided to yield a small effective sensor spring constant K.sub.eff =K.sub.m -K.sub.e. Methods are also provided to manufacturing the apparatus by specifying the mechanical spring constant and providing an electric spring constant which will yield a desired effective spring constant which produces a desired characteristic of the sensor structure. Alternatively, the apparatus may be manufactured by specifying the electric spring constant which, with a mechanical spring constant, provides a certain sensor structure characteristic, e.g., natural frequency, and then providing a connecting arrangement characterized by a mechanical spring constant which yields such sensor characteristic. According to another aspect of the invention, the sensing force applied to the mass is adjusted in coordination with the mechanical spring constant and damping factor of the apparatus so that a desired characteristic of the apparatus is achieved.

Apparatus with mechanical and electric springs and method for its

A sensor structure (10) has a central mass (16) mounted within a support structure comprising an outer frame (18) with upper and lower covers (12, 14). Eight L-shaped or elbow-shaped ribbon springs are fit about the corners (28) of the mass (16) to allow mass (16) for movement from a reference position with respect to the support structure. One leg of each spring is connected to the middle of an associated side (26A) of the mass (16) while the other leg is connected to the outer frame (18). According to an alternative embodiment, each of the springs (72) is characterized by a relatively larger width at spring-mass connection point (74) and at spring-support connection point (73) and a relatively smaller width at an elbow-bend region between connection points. Narrow gaps G, G' and G' between spring and support, spring and mass and spring and adjacent springs provide lateral stops such that the spring laterally contacts the support or the mass or in adjacent spring before it breaks in response to extremely large lateral forces in the structure. The sensor structure is designed for use as a sensing mechanism in an electrostatic accelerometer arrangement.

Sensor structure with L-shaped spring legs

A sensor structure (10) has a central mass (16) mounted within a support structure comprising an outer support frame (18), and upper and lower plates or covers (12, 14). Eight L-shaped ribbon springs (32, 34) fit about the corners (28) of the mass (16) to mount mass (16) for movement from a reference position with respect to the support structure. One leg (38) of each spring (32, 34) is connected to an associated side (26A) of the mass (16) centrally of the length of the associated side (26A). The other leg (40) is connected to the outer support frame (18). The sensor structure is designed for use as a sensing mechanism in an electrostatic accelerometer arrangement.

An improved device for monitoring the presence of a person, animal or piece of property within a predefined space. The invention consists of a means for attaching to a monitoree, a transmitter assembly containing electronic circuitry which periodically sends a coded signal a limited distance to a remote detection unit. If the expected signal is not received, indicating that the person or object has been removed from the predefined space, an alarm condition is indicated. The transmitter is securely attached to the item being monitored by means of a non-stretchable, flexible, circuit strap which indicates an alarm condition when the strap is tampered with. The strap is locked into the transmitter assembly by a latch key which also triggers the transmitter to begin sending signals. The device is easily reattached or transferred to another item to be monitored by monitoring personnel by removing the latch key and inserting a new latch key after the device has been reinstalled.

Tamper detect monitoring device

A transducer fabricated by micro-machining includes E-shaped leaf springs suspending a mass from a support. The transducer is formed by chemical etching through openings of opposite faces of a silicon wafer on which etch stop layer patterns are diffused. Sense and force conductive patterns are diffused onto opposite faces of the suspended mass. The legs of the E-shaped leaf springs are formed of a composite of a polysilicon base layer, a silicon dioxide insulating layer and a gold conducting layer. The thickness of such layers are selected to minimize bowing effects of the spring legs due to materials of different coefficients of thermal expansion. The spring-mass-support structure is sandwiched between opposite plates having corresponding force and conductive patterns which face such patterns on the suspended mass.

Micro-machined accelerometer with composite material springs

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Austin, TX, United States of America

Matthew W Ip