International Business Machines Corporation

Airogistic, L.l.p

Matthew Tant Richardson

David Paul Barron

Phillip V Mann

Christopher William Mann

Mark Kenneth Hoffmeyer

Howard Victor Mahaney, Jr

Roger Duane Hamilton

Jason R Eagle

Stephen Peter Mroz

Howard V Mahaney, Jr

Ethan E Cruz

Ray Clement Laning

Michael Foley

Scott R Lapree

Steven L Schwark

Jeffrey Charles Michalski

A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Integrated circuit device assembly

Cooling systems employing adjacent fan cages having cage walls with interflow passages are disclosed. A cooling system includes cooling fans disposed in adjacent fan cages. Cage walls of the fan cages direct flows from the fans to the outlet ports of the fan cages which are in fluid communication with electrical components within an electronics-containing enclosure. By forming an interflow passage between the adjacent fan cages, upon occurrence of an inoperable fan, a portion of the flow from an adjacent operable fan can pass to the outlet port of the fan cage of the inoperable fan via the passage and provide better cooling of the components impacted by the inoperable fan. In this manner, thermal damage is avoided while minimizing fan noise associated with higher fan speeds.

Cooling system for electronic devices employing adjacent fan cages with interflow passages

An approach is provided in which a system includes a lid detection mechanism that prevents a power supply unit from being electrically coupled to the system when a lid is detached from the system's chassis. According to another embodiment of the present disclosure, the system includes a power supply unit detection mechanism that prevents the lid from being detached from the system's chassis when the power supply unit is electrically coupled to the system.

Lid and power supply interlock mechanism

A heatsink structure cools a first electronic chip and a second electronic chip that are positioned serially and in-line to one or more cooling fan, such that cooling air from the cooling fan(s) passes above the first electronic chip before passing above the second electronic chip. The heatsink structure includes a first heatsink and a second heatsink, which are identical to each other, and which fit adjacent to one another when a first heatsink is rotated 180 degrees relative to the second heatsink.

Heatsink providing equivalent cooling for multiple in-line modules

Server bezel

Embodiments include systems and methods for collection and identification of particulates in the air. In one embodiment, two different path ways are provided from a single adjustable inlet: one for collection and one for detection. A removable insert positionable within a collection tube enables a user to switch between the collection mode and the detection mode. This embodiment captures both the physical mechanisms of switching the air flow paths as well as sequencing of controls and valves and regulation or changing the air flow rate in the different modes of operation. This and other embodiments are disclosed herein.

Systems and methods for collection and detection of particulates in the air

Growing community of inventors

Austin, TX, United States of America

Matthew Tant Richardson