Intel Corporation

Matthew T Magnavita

Amram Eitan

Zhaozhi Li

Peng Chen

Donglai David Lu

An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the electronic component by melting the metal powder onto the electronic component. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the substrate by melting the metal powder onto the substrate. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; an initial mold covering the electronic component; and a porous coating that includes grains of metal powder formed onto the initial mold by melting the metal powder onto the initial mold.

Growing community of inventors

Gilbert, AZ, United States of America

Matthew T Magnavita