Echostar UK Holdings Limited

Eldon Technology Limited

Echostar Technologies Corporation

Matthew Stephens

David Burton

Greg Blythe

Trevor Hardaker

Chris Lockwood

Stewart Marlow

Bhavesh Tailor

Robert Legg

David Robert Burton

Various arrangements are presented for handling broadcast television commercials. A television receiver may receive, from a television service provider, metadata that indicates a commencement of a television commercial break and an expected duration. Based on the metadata, the television receiver may initiate a countdown timer such that the countdown timer is based on the expected duration of the television commercial break and counts down.

Systems and method for timing commercial breaks

Systems and methods are operable to securely store media content events on a flash memory device. An exemplary embodiment receives user-provided authorization information, compares the received user-provided authorization information with authorization information associated with the flash memory device, and permits access to a flash memory of the flash memory device when the received user-provided authorization information corresponds to the authorization information.

Apparatus, systems and methods for securely storing media content events on a flash memory device

Various arrangements are presented for handling broadcast television commercials. A television receiver may receive, from a television service provider, metadata that indicates a commencement of a television commercial break and an expected duration. Based on the metadata, the television receiver may initiate a countdown timer such that the countdown timer is based on the expected duration of the television commercial break and counts down. The television receiver may output for presentation a remaining duration based on the countdown timer as the countdown timer counts down.

A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Media content device chassis with internal extension members

A media device includes at least one piezoelectric fan selectively located to draw or urge air past one or more electrical components, such as an integrated circuit chip. Preferably, the piezoelectric fan is located within a channel milled or otherwise formed in the chip, however the fan may be located proximate the channel yet in fluid communication therewith. The piezoelectric fan operates to convectively cool the electrical component and may also prevent heat that has been generated by the electrical component from moving toward another electrical component within the media device. Thus, the configuration and location of the piezoelectric fan may advantageously cool one component while preventing heat energy from building up around one or more other components mounted nearby.

Media device having a piezoelectric fan

A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.

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Harrogate, United Kingdom

Matthew Stephens