Northrop Grumman Systems Corporation

Matthew S Torpey

Benjamin Andrew Copley

Jeffrey David Hartman

Wayne Stephen Miller

David J Gillooly

Justin B Kennard

Andrew S King

One example includes an acoustic resonator filter bank system. The system includes a multiplex passive filter that is configured to provide a plurality of filtered versions of a radio frequency (RF) input signal. The system also includes a filter bank that comprises a plurality of filter blocks that are each configured to provide a plurality of pass-bands across a frequency spectrum. Each of the filter blocks includes an acoustic resonator. The system further includes a switch matrix that is configured to provide one of the filtered versions of the RF input signal to one of the filter blocks in the filter bank to provide an RF output signal having a frequency band corresponding to a respective one of the pass-bands.

Acoustic resonator filter bank system

An apparatus includes a top conductive layer of on an integrated circuit waveguide filter and a bottom conductive layer. The top and bottom conductive layers are coupled via a plurality of couplers that form an outline of the waveguide filter. A dielectric substrate layer is disposed between the top conductive layer and the bottom conductive layer of the integrated circuit waveguide filter. The dielectric substrate layer has a relative permittivity, &#x3b5;r that affects the tuning of the integrated circuit waveguide filter. At least one tunable via includes a tunable material disposed within the dielectric substrate layer and is coupled to a set of electrodes. The set of electrodes enable a voltage to be applied to the tunable material within the tunable via to change the relative permittivity of the dielectric substrate layer and to enable tuning the frequency characteristics of the integrated circuit waveguide filter.

Voltage controlled tunable filter

A surface mount technology (SMT) device can include an SMT interface on a given side of the SMT device. The SMT interface can include an interface ground plane formed of conductive material. The SMT interface can also include a plurality of signal pads formed of the conductive material. Each signal pad can be encircled by one of a plurality of isolation regions formed from a non-conductive region of the SMT interface. The SMT device is configured for mounting on a printed wiring board (PWB) that includes a board interface having substantially the same shape at the SMT interface.

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Ellicott City, MD, United States of America

Matthew S Torpey