Ge Lighting Solutions LLC

Lumination LLC

Delphi Technologies, Inc.

Gelcore, LLC

Gm Global Technolgoy Operations, Inc.

Matthew S Mrakovich

Mark J Mayer

Jeffrey Marc Nall

Tomislav Josip Stimac

Srinath K Aanegola

Ronald K Brengartner, Jr

Emil Vergilov Radkov

James Reginelli

Larry R Stadelman

Nicolo Machi

John V Denuto

Koushik Babi Saha

Yu Pan

Paul Southard

Alan B Toot

William David Sekela

David J Page

Babi Koushik Saha

Xiaomei Lou

Thomas Edward Zink

Mark Scarlato

Stanton Earl Weaver, Jr

Thomas Frederick Soules

James Thomas Petroski

Mathew L Sommers

David Mark Johnson

Christopher L Bohler

Chenyang Li

Shawn Du

Timothy Mazies

Michael F Augustine

Michael McCoy

John V DeNuto

Ronald Brengartner

William D Sekela

Thomas E Zink

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light emitting diode component

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100&#xb0; C. and has a thermal conductivity greater than or about 1 W/m&#xb7;K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

LED lighting assemblies with thermal overmolding

Provided is a receptacle for installation within a lighting fixture. The receptacle includes a platform (i) for exposure external to the lighting fixture and (ii) providing connectivity for coupling to an external control device and a base operationally coupled to the platform and including a first set of one or more nodes configured for coupling to a first set of wires.

Photo-electric receptacle luminaire integration point

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 &#xb0; C. and has a thermal conductivity greater than or about 1 W/m&#xb7;K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

A light fixture suitable for illuminating a remote surface. The fixture includes a post adapted to receive at least two substantially identical light engine modules. Each module includes a plurality of light emitting diodes. Each module includes an edge adapted for mounting to the post.

Modular light engine for variable light pattern

Methods of manufacturing lighting assembly with thermal overmolding

A solid state replacement light module for a high intensity discharge light fixture. The module is comprised of an elongated generally planar body having a first side including a plurality of light emitting diodes and a second side including a plurality of heat dissipating fins. The second side further includes an electronic module. The body also includes a hinge mechanism suitable for attachment to the light fixture.

LED retrofit module for roadway fixture

Method of manufacturing a lighting assembly with thermal overmolding

The luminaire comprises a housing including at least one optical module. The optical module has a plurality of light emitting diodes disposed within a reflector. The reflector includes opposed curved longitudinal walls and opposed curved end walls.

LED roadway luminaire

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.

Growing community of inventors

East Cleveland, OH, United States of America

Matthew S Mrakovich