Hamilton Sundstrand Corporation

Matthew S Fitzpatrick

Jay W Kokas

Kevin P Roy

Richard A Poisson

Michael Maynard

Edward John Marotta

Judy Schwartz

John D Pennell

Luke T Orsini

Marc S McCloud

Richard M Speziale

Robert C Hoeckele

A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.

Vertical mount transient voltage suppressor array

A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.

Vertically mounted multi-hybrid module and heat sink

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Portland, CT, United States of America

Matthew S Fitzpatrick