Dana Canada Corporation

Matthew S Birkett

John G Burgers

Andrei Catuneanu

Jingyuan Liang

Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.

Systems for thermal management of an electronic device

A heat exchanger capable of conforming to expansion/contraction due to external stresses as well as adjusting/adapting to surface imperfections at the interface of the heat exchanger with additional components is disclosed. The heat exchanger is made up of various heat exchanger elements where the elements are interconnected in such a manner that they can shift relative to one another along and/or about different axes while maintaining fluid flow through the heat exchanger. Each element has a fluid inlet, fluid outlet and a flow passage extending therebetween, the elements being arranged such that the outlet of one element is fluidly connected to the inlet of the adjacent element. The individual elements are also physically interconnected to allow for longitudinal and/or lateral shifting in response to external expansion/contraction forces while maintaining fluid flow through the entire heat exchanger, as well as to tilting about each of these axes.

Growing community of inventors

Toronto, Canada

Matthew S Birkett