Kulicke & Soffa Netherlands B.v.

Ndsu-research Foundation

Matthew R Semler

Val Marinov

Ronn Kliger

Samuel Brown

Zhigang Chen

Rudolphus Hendrikus Hoefs

Mark Pavicic

Orven Swenson

Ross A Miller

Ferdous Sarwar

A system includes a vacuum chuck; and a tape. The tape includes a flexible polymer substrate; and an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate. The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate.

Adhesive tapes for receiving discrete components

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Parallel assembly of discrete components onto a substrate

A method includes determining an alignment error between a discrete component of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including the discrete component adhered to a support by a dynamic release layer; based on the alignment error, determining a beam offset characteristic; and providing a signal indicative of the beam offset characteristic to an optical element of the laser-assisted transfer system, the optical element being configured to adjust a position of a beam pattern relative to the discrete component according to the beam offset characteristic.

Positional error compensation in assembly of discrete components by adjustment of optical system characteristics

Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Selective laser-assisted transfer of discrete components

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Fargo, ND, United States of America

Matthew R Semler