3m Innovative Properties Company

Solventum Intellectual Properties Company

Matthew R D Smith

Matthew S Stay

Mikhail L Pekurovsky

Ann M Gilman

Saagar A Shah

Daniel J Theis

Kara A Meyers

Jeremy K Larsen

Jeremy O Swanson

William Blake Kolb

Gilles J Benoit

Carl A Stover

Richard Paul Rusin

Yizhong Wang

Shawn C Dodds

Graham M Clarke

Tri Dinh Pham

Ross E Behling

Bharat R Acharya

David T Yust

Robert D Taylor

Roger W Barton

Anthony M Renstrom

Evan D Brutinel

Quinn D Sanford

Matthew S Cole

Jason S Petaja

Kui Chen-Ho

James N Dobbs

Mark F Ellis

Kathleen S Shafer

Ronald P Swanson

Michele A Craton

Bhaskar V Velamakanni

Ankit Mahajan

Kayla C Niccum

Thomas J Metzler

Teresa M Goeddel

Matthew E Sousa

Lyudmila A Pekurovsky

David A Rosen

Lin Zhao

Eric A Vandre

Benjamin J Forsythe

Joseph P Attard

Qunyi Chen

Gino L Pitera

Lisa A DeNicola

Jon E Dable

Kelly A Volp

Cyrus A Anderson

James Zhu

James F Poch

Jonathan W Kemling

Paul R Klaiber

Anish Kurian

Patrick J Yeshe

Kevin T Reddy

Aaron T Hedegaard

Jae Yong Lee

Brian E Schreiber

Xiaoming Jiang

Jessica Chiu

Joseph B Farley

Clinton J Cook

Joseph E Hernandez

Adam W Kiefer

Jennifer J Post

A display system for sensing a finger of a user applied to the display system includes a display panel; a sensor for sensing the finger; a sensing light source configured to emit a first light having a first wavelength W1; and a reflective polarizer disposed between the display panel and the sensor. For a substantially normally incident light, an optical transmittance of the reflective polarizer versus wavelength for a first polarization state has a band edge such that for a first wavelength range extending from a smaller wavelength L1 to a greater wavelength L2 and including W1, where 30 nm≤L2−L1≤50 nm and L1 is greater than and within about 20 nm of a wavelength L3 corresponding to an optical transmittance of about 50% along the band edge, the optical transmittance has an average of greater than about 75%.

Display system with finger sensing

Methods and systems of using pocket roller () to place objects on a continuously moving web () are provided. The objects are received in an array of pockets () on a major surface of a roller sleeve (). The roller sleeve () engages with an adhesive surface () of the continuously moving web () to place the objects on the web ().

Methods and systems of using pocket roller to place objects on moving web

A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

Methods for registration of circuit dies and electrical interconnects

Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate () has its major surface in contact with a first major surface () of a stencil shell () having apertures (). A coating material is disposed onto the second major surface () of the stencil shell () to flow through the apertures () to contact the substrate (), where the coating material is at least partially cured. The substrate () is separated (C) from the first major surface () of the stencil shell () after the curing () and a pattern () of the at-least-partially-cured coating material is formed on the substrate ().

Methods and systems for stencil printing

Optical films are described. In particular, optical films including a broadband polymeric multilayer optical reflector and a discontinuous transparent coating disposed on the broadband multilayer optical reflector, where the discontinuous transparent coating includes an array of dots are described. Such films may provide reduced coefficients of friction while still having high specular reflectivity.

Optical film including polymeric optical reflector and discontinuous transparent coating

A display system for sensing a finger of a user applied to the display system includes a display panel; a sensor for sensing the finger; a sensing light source configured to emit a first light having a first wavelength W; and a reflective polarizer disposed between the display panel and the sensor. For a substantially normally incident light, an optical transmittance of the reflective polarizer versus wavelength for a first polarization state has a band edge such that for a first wavelength range extending from a smaller wavelength Lto a greater wavelength Land including W, where 30 nm≤L−L≤50 nm and Lis greater than and within about 20 nm of a wavelength Lcorresponding to an optical transmittance of about 50% along the band edge, the optical transmittance has an average of greater than about 75%.

A curable mixture, a partially cured composition, a cured composition, an article containing either the partially cured composition or the cured composition, and a method of bonding two substrates are provided. The partially cured composition functions as a pressure-sensitive adhesive while the cured composition functions as a structural or semi-structural adhesive. The curable mixture can be applied to a first substrate by printing or dispensing, if desired.

Printable curable mixtures and cured compositions

Modified adhesive layers are prepared by contacting an adhesive layer to a modified microstructured release liner. The modified release liner has a release layer surface with a set of microstructured depressions and a discontinuous pattern of ink material located on the surface of the release layer. A portion of the discontinuous pattern of ink material overlaps with and is located within some of the depressions. The ink material comprises a non-adhesive but adhesively transferrable material, or an adhesive material. Upon removal of the adhesive from the release liner, the ink material transfers to the adhesive surface.

Microstructured release liners for selective transfer of ink to film

A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

Electronic devices comprising a via and methods of forming such electronic devices

Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.

Methods of passivating adhesives

Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.

Electronic devices including solid semiconductor dies

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

Automatic registration between circuit dies and interconnects

Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to adhesively bond the particles to a pressure-sensitive adhesive surface of the substrate.

Process for depositing dry powder particles onto a substrate and adhesively bonding the particles to the substrate

Methods and apparatuses for applying liquid coatings are provided. A first roll (), a second roll (), and a nip () formed between the first and second rolls are provided. A coating liquid () is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer () of liquid coating which is transferred to a substrate (). The second roll () includes a thin metal shell () and a resilient layer (), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll ().

Liquid coating method and apparatus with a deformable metal roll

Growing community of inventors

Woodbury, MN, United States of America

Matthew R D Smith