Skyworks Solutions, Inc.

Keysight Technologies, Inc.

Matthew Ozalas

David Steven Ripley

Philip John Lehtola

Peter J Zampardi

Hongxiao Shao

Tin Myint Ko

Hong Shen

Hsiang-Chih Sun

Jens Albrecht Riege

Mehran Janani

Weimin Sun

Anthony James Lobianco

Hoang Mong Nguyen

Howard E Chen

Dinhphuoc Vu Hoang

Guohao Zhang

Matthew Sean Read

Hardik Bhupendra Modi

Sandra Louise Petty-Weeks

Patrick Lawrence Welch

Yifan Guo

Anne Marie Hawkins

Praveen Vs

Rameshwar Singh

One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via

One aspect of this disclosure is a power amplifier system that includes a control interface, a power amplifier, a passive component, and a bias circuit. The power amplifier and the passive component can be on a first die. The bias circuit can be on a second die. The control interface can operate as a serial interface or as a general purpose input/output interface. The power amplifier can be controllable based at least partly on an output signal from the control interface. The bias circuit can generate a bias signal based at least partly on an indication of the electrical property of the passive component. Other embodiments of the system are provided along with related methods and components thereof.

Power amplifier systems with control interface and bias circuit

A method for operating a data processing system that causes the data processing system to test the consistency between a schematic description of an electronic circuit and a physical implementation of that circuit includes a master device having a plurality of component devices connected by a network of conductors is disclosed. Each of the component devices has a plurality of package pins that connect the component device to the network of conductors. Information specifying a schematic netlist generated from the schematic description and specifying a layout description of the physical implementation is received by the data processing system. The layout description specifies the network of conductors. The data processing system determines any package shorts in the component devices and generates a layout netlist from the layout description. The layout netlist is compared with the schematic netlist.

Method for performing a layout versus schematic test for a multi-technology module

One aspect of this disclosure is a power amplifier module that includes a power amplifier on a substrate and a semiconductor resistor on the substrate. The power amplifier includes a bipolar transistor having a collector, a base, and an emitter. The collector has a doping concentration of at least 3&#xd7;10cmat an interface with the base. The collector also has at least a first grading in which doping concentration increases away from the base. The semiconductor resistor includes a resistive layer that that includes the same material as a layer of the bipolar transistor. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including transistor with grading and semiconductor resistor

The present disclosure relates to a system for biasing a power amplifier. The system can include a first die that includes a power amplifier circuit and a passive component having an electrical property that depends on one or more conditions of the first die. Further, the system can include a second die including a bias signal generating circuit that is configured to generate a bias signal based at least in part on measurement of the electrical property of the passive component of the first die.

Process-compensated HBT power amplifier bias circuits and methods

One aspect of this disclosure is a power amplifier module that includes a first die including a power amplifier and a passive component, the power amplifier including a bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3&#xd7;10cmat an interface with the base, the collector also having a grading in which doping concentration increases away from the base; and a second die including a bias circuit configured to generate a bias signal based at least partly on an indication of an electrical property of the passive component of the first die and to provide the bias signal to the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods

A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3&#xd7;10cmat a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including related systems, devices, and methods

Growing community of inventors

Novato, CA, United States of America

Matthew Ozalas