The Hong Kong University of Science and Technology

Matthew Ming Fai Yuen

Cheng Yang

Bing Xu

Shi-Wei Lee

Xinfeng Zhang

Jingshen Wu

Hon Shing Lau

Haibo Fan

Haibin Chen

Kai Zhang

Chi Chuen Lo

Ross David Murch

Bo Gao

Kan Kan Yeung

David Chuen Chun Lam

Alexander Ka Ngai Lam

Wayman Ngai Man Wong

Zhaoli Gao

Chi Hang Chon

Edward King Long Chan

Kit Ying Wong

George Alexandru Tilita

Min Zhang

Wenhao Chen

John Ching Kwong Kwok

Huansu Xu

Chi Fong Kwan

Zhen Qin

Chi Ho Cheng

Embodiments disclosed herein represent powder based additive manufacturing processes which provide a microstructure having improved mechanical properties. The methods may include the use of ultrasonic excitation in combination with the active control of a substrate's temperature to provide some level of control over the microstructure and hence the properties.

Method for additively manufacturing a component augmented by ultrasonic excitation and active temperature control

A device is designed to remove blockages in a lumen such as a thrombus, blood clot, or embolus. The device comprises a manipulating wire and a structure that can conduct electrical current to a lumen blockage. The electrical current is preferably in radio frequency (RF). The RF electric current in the blockage can excite the contents such as proteins of the blockage, so that cross-linking density and interfacial adsorption of the entire blockage is enhanced. The enhanced cross-linking density can result in increased fracture resistance of the blockage such that fracture of the blockage during the removal process is unlikely. The enhanced interfacial adsorption results in increased interfacial fracture resistance between the device and blockage so that the blockage can be securely captured during the removal process without using radially applied force.

Radio frequency electro-thrombectomy device

A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

Three dimensional interconnected porous graphene-based thermal interface materials

A conductive thin film device includes a substrate and a thin film structure applied to the substrate. The thin film structure is applied as a first layer and forms a one-dimensional nanomaterial networked layer deposited on the substrate. A coating layer overlays the one-dimensional nanomaterial networked layer and can be made from graphene or graphene oxide. The coating layer at least partially covers the nanomaterial networked layer, thereby forming the device as a double-layer structure.

Electrical and thermal conductive thin film with double layer structure provided as a one-dimensional nanomaterial network with graphene/graphene oxide coating

Monodispersed silver nanowires are formed by a process utilizing a polyol. A capping agent is mixed in the polyol to form a substantially homogeneous solution. The solution is heated to a level below a boiling point of the polyol. The solution is diluted with a diluent which may consist of water and/or alcohol, and the solution is centrifuged to produce the silver nanowires.

Method of producing silver nanowires in large quantities

An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects

A heat dissipation structure with aligned carbon nanotube arrays formed on both sides. The carbon nanotube arrays in between a heat source and a cooler are used as thermal interface material extending and dissipating heat directly from a heat source surface to a cooler surface. In some embodiments, an adhesive material can be used to dispense around carbon nanotube arrays and assemble the heat dissipation structure in between a heat source and a cooler. In some other embodiments, carbon nanotube arrays are formed on at least one of a heat source surface and a cooler surface and connect them together by further growing. The carbon nanotube arrays can be exposed to the environment instead of being in between a heat source and a solid cooler, and can serve as fins to enlarge heat dissipation area and improve thermal convection.

Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use

Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process and is useful for transfer of printing material to a substrate in order to establish printed circuit components such as circuit traces and printed circuit elements on the substrate. In a particular configuration the ultraviolet radiation responsive material can be made of azobenzene material or free radical initiators.

Printing using a structure coated with ultraviolet radiation responsive material

An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.

Implementing self-assembly nanometer-sized structures within metal&#x2014;polymer interface

An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

Percolation efficiency of the conductivity of electrically conductive adhesives

The present invention relates to an RFID Tag and Antenna for use with an RFID tag and a method of radio frequency identification (RFID). The RFID Tag comprises a RFID chipfor storing data, an antennaand an electromagnetic band gap substrate. The RFID chipand the antennaare mounted above the electromagnetic band gap substrate. The electromagnetic band gap substrate has a reflection phase which is different from 180&#xb0; at the operation frequency of the antenna. The electromagnetic band gap substrate enables the RFID to operate even if it is mounted on a conductive object, as the reflection phase is not 180&#xb0; so it does not destructively interfere with the radiation from the antenna at the operating frequency. Preferably the reflection phase is between 340&#xb0; and 115&#xb0; or &#x2212;95&#xb0; and 145&#xb0;. The preferred embodiment uses a band gap substrate having two mushroom-like conductive layerswith a dielectric in between.

Growing community of inventors

Hong Kong, China

Matthew Ming Fai Yuen