Huawei Technologies Co., Limited

Huawei Technologies Canada Co., Ltd.

Matthew Milyavsky

Tao Wu

Halim Boutayeb

Teyan Chen

Fayez Hyjazie

A method is disclosed of mounting a heat sink through a printed circuit board to reach a component on the opposite side of a board. The heat sink is passed through a window in the board to contact a component at a predetermined pressure optimized for thermal performance at minimum stress. The heat sink is affixed in place on the printed circuit board using through-hole pins which can be soldered to maintain the heat sink's position and the predetermined pressure.

Method and apparatus for heat sink mounting

The disclosed structures and methods are directed to antenna systems configured to transmit and receive a wireless signal in and from different directions. An antenna structure comprises a pair of horizontal-polarization (HP) antenna units forming a first parallel-plate waveguide. One of the HP antenna units and a base unit form a second parallel-plate waveguide. The antenna further comprises a pair of vertical-polarization (VP) antenna units each located in one of the first and second parallel-plate waveguides. Each HP antenna unit comprises inverted F antennas (IFAs) configured to radiate a radio-frequency (RF) waves that are horizontally polarized. Each VP antenna unit comprises VP excitation elements configured to radiate the RF waves that are vertically polarized. A method for manufacturing of the antenna structure is also disclosed.

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Ottawa, Canada

Matthew Milyavsky