Applied Materials, Inc.

Matthew Miller

Dmitry Lubomirsky

Shankar Venkataraman

Jian Li

Soonam Park

Qiwei Liang

Paul Brillhart

Xinglong Chen

Toan Q Tran

Adib M Khan

Jang-Gyoo Yang

Kien Nai Chuc

Hanh D Nguyen

Katherine Woo

Shinnosuke Kawaguchi

Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The assemblies may include a power transmission rod coupled with the electrode. The power transmission rod may include a material characterized by a coefficient of thermal expansion of less than or about 10×10/° C.

Semiconductor substrate support power transmission components

Apparatus and methods for gas distribution assemblies are provided. In one aspect, a gas distribution assembly is provided comprising an annular body comprising an annular ring having an inner annular wall, an outer wall, an upper surface, and a bottom surface, an upper recess formed into the upper surface, and a seat formed into the inner annular wall, an upper plate positioned in the upper recess, comprising a disk-shaped body having a plurality of first apertures formed therethrough, and a bottom plate positioned on the seat, comprising a disk-shaped body having a plurality of second apertures formed therethrough which align with the first apertures, and a plurality of third apertures formed between the second apertures and through the bottom plate, the bottom plate sealingly coupled to the upper plate to fluidly isolate the plurality of first and second apertures from the plurality of third apertures.

Flow control features of CVD chambers

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Newark, CA, United States of America

Matthew Miller