Compaq Computer Corporation, Inc.

Matthew L Webb

Charles A Sellers

Kevin F Clancy

Michael S Lempicki

A computer having a heat sink structure incorporated therein provides efficient heat dissipation for heat generating components within the computer. In a preferred embodiment, a computer has a chassis, a circuit board with a heat generating device mounted thereon, and a structural member with a heat pipe disposed thereon. The heat pipe transfers heat from the heat generating device to a heat dissipating portion of the structural member. The structural member strengthens the chassis and provides convective transfer of the heat to the environment.

Computer having a heat sink structure incorporated therein

A notebook computer is provided with a collapsible keyboard structure having keys supported on scissored linkage arm assemblies in which, in response to closing of the computer housing lid, key return spring portions of the keyboard are shifted away from their normal underlying relationships with the keys, and the scissored linkage arm assemblies and keys are permitted to retract to a storage/transport orientation in which the overall thickness of the keyboard structure is reduced by an amount essentially equal to the stroke distance of the keys. When the lid is subsequently opened, the key return spring portions are shifted back to their normal underlying relationships with the keys, and the keys and scissored linkage arm assemblies are forced outwardly by the return spring portions to their extended, operative orientations above the return spring portions. A spaced series of elastomeric key return dome members is secured to a shift member which is slidably mounted on the top side of a multilayered signal pad structure.

Growing community of inventors

Houston, TX, United States of America

Matthew L Webb