Georgia Tech Research Corporation

Tcpoly Inc.

Alliance for Sustainable Energy, LLC

Matthew Kirby Smith

Thomas Lloyd Bougher

Baratunde A Cola

Kyriaki Kalaitzidou

Virendra Singh

Adewale Odukomaiya

Kaif Dosani

Paramjot Singh

Allison Jasmine Mahvi

The present disclosure relates to encapsulation of a phase change material (PCM) enabled by extrusion of a thermoplastic polymer shell and a PCM core, which can be additively manufactured to form a variety of designs for use in a variety of settings, including for use as thermal energy storage devices in building heating ventilation and air conditioning (HVAC) systems. The thermoplastic polymer shell surrounding a PCM core may be used as a filament in three-dimensional (3D) printing or may be extruded during the additive manufacturing process.

Phase change material core thermoplastic shell filament

A thermal management device includes a single contiguous component. The single contiguous component includes a first portion made of a first thermally conductive plastic, and a second portion extending away from the first portion. The second portion is made of a second thermally conductive plastic. The second thermally conductive plastic is different than the first thermally conductive plastic. The second portion has a greater hardness than the first portion.

Additive manufactured multi-layer thermally conductive parts

In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.

Polymer-polymer fiber composite for high thermal conductivity

Nano structured surfaces and bulk composite materials which exhibit tunable surface morphology, wettability, thermal conductivity, and total thermal resistance properties, and methods of fabrication and uses thereof are described herein. Arrays of vertically-aligned nanostructures produced via a template assisted fabrication approach using nanoporous templates, or alternatively, via an electropolymerization process are described. As a result, control over the surface morphology and wettability can be achieved using the selective template etching process. The composite materials also demonstrate tunable thermal and electrical properties based on the methods of their fabrication. The arrays of polymeric nanostructures are chemically, mechanically, and thermally robust and can serve as soft substrates with heat dissipation capability for use in the fabrication of thermal management materials, tunable wetting for microfluidic applications, and for use in heterojunction organic photovoltaic cells.

Polymer-based nanostructured materials with tunable properties and methods of making thereof

Growing community of inventors

Atlanta, GA, United States of America

Matthew Kirby Smith