Hewlett-packard Company

Agilent Technologies, Inc.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Panasonic Precision Devices Co., Ltd.

Matthew K Schwiebert

Hubert A Vander Plas

Robert E Kraft

Matthew Heydinger

Donald T Campbell

Geary L Chew

Kenneth Allen Honer

Ron Jay Barnett

R Sean Murphy

Nels Jewell-Larsen

Brian R Hutchison

Guilian Gao

Gary Richard Trott

Dean B Nicholson

Andrew Engel

Gerald J Gleason

Andy H Uchida

John Wilks

Ayn R Lavagnino

Robert J Thompson

Ron Goldman

Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices

Cleaning and/or conditioning electrode surfaces can provide significant performance and operational benefits in EHD devices. In particular, conditioning of emitter electrode surfaces with silver (Ag), silver compositions or silver preparations applied in situ at successive times throughout the operating lifetime of an EHD air mover has been found to significantly reduce ozone production. Structures and techniques are described for in situ conditioning electrode surfaces and, in particular, emitter electrode surfaces of an EHD device such as an air mover or precipitator, with a conditioning material that includes silver.

System and method for in-situ conditioning of emitter electrode with silver

In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground conductor. The component includes a device having a signal line and a ground conductor, a package, and a signal lead. The signal lead is electrically coupled to an internal signal path of the package and has an external portion extending from the package to the signal conductor of the interconnection substrate. The discontinuity compensator electrically couples a ground path of the package to the ground conductor of the interconnection substrate. The discontinuity compensator includes an electrically conducting planar surface that is oriented in a plane intersecting the interconnection substrate and forms with at least a substantial part of the external portion of the signal lead a transmission line structure having an impedance substantially matching the nominal impedance over the specified bandwidth.

Impedance matching external component connections with uncompensated leads

A monolithic bail-delatch mechanism is provided for a module plugged into a cage. The bail-delatch mechanism is a single monolithic unit that includes a living hinge connecting a bail and a delatch clip. The living hinge, the bail, and the delatch clip may be made of a single injection molded plastic part. The bail may include cantilever hooks for securing the bail against the module in a latched position. The delatch clip may include a spring mechanism having two spring arms for locking the bail-delatch mechanism to the module, and a delatch fork having tines with wedges for releasing a post of the module from a latch tab of the cage.

Monolithic living hinge small form factor transceiver bail-delatch

A fiber optic module includes a first housing insert molded with an electromagnetic interference (EMI) shield, an optoelectronic subassembly mounted in the first housing, and a second housing mounted to the first housing to enclose the optoelectronic subassembly. The EMI shield includes a conductive mesh and conductive contact fingers. The first housing includes a non-conductive housing floor, non-conductive housing sidewalls, and a non-conductive nose defining at least one connector receptacle, wherein the housing floor and the housing sidewalls are injection molded through the mesh of the EMI shield to be integral with the nose and so that the fingers at least partially surround the nose.

Integral insert molded fiber optic transceiver electromagnetic interference shield

Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate such as a printed circuit board. The integral dielectric heatspreader may also support integral transmission lines, resistors, capacitors, or other bulk components. Performance of the heatspreader is enhanced through the use of thermal vias on a printed circuit board.

Integral dielectric heatspreader

A surface mountable coaxial solder interconnect. The invention provides a small, low-cost, passively self-aligning, high-frequency electronic interconnect adapted to mass production and method. The invention includes a substrate, a signal conductor, and an annular conductor. The substrate incorporates an annular pad and a signal pad substantially centered within the annular pad. The signal conductor includes reflowed solder and is wetted to the signal pad. Similarly, the annular conductor includes reflowed solder and is wetted to the annular pad. The invention may also provide a second substrate substantially parallel to the first substrate that includes a second annular pad and a second signal pad substantially centered within the second annular pad. In such a case, the signal conductor is also wetted to the second signal pad, and, similarly, the annular conductor is also wetted to the second annular pad. The method of the invention includes obtaining a mask and a substrate. The mask obtained defines a center cavity and an annular cavity surrounding the center cavity, and may also define an outer cavity in fluidic communication with the annular cavity. The substrate obtained includes a solder-wettable signal pad, and a solder-wettable annular pad surrounding the signal pad. The mask is then filled with solder paste and aligned with the substrate such that the center cavity of the mask is in registry with the signal pad. The solder paste is then reflowed, generating solder wetting the solder-wettable signal pad and the solder-wettable annular pad.

Surface mountable coaxial solder interconnect and method

The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.

Solder paste containment device

A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.

High-frequency electronic package with arbitrarily-shaped interconnects

A mask support device including two communicating elements, a first element having ferromagnetic shunts, and a second element containing permanent magnets, and wherein the elements are rotatable about a central axis and assume fixed positions in the rotation. The mask support device in one position attracts a ferromagnetic metal mask. In a second position, owing to the shunt redirecting the magnetic field, releases the metal mask.

Shuntable magnetic mask support apparatus

A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Method of bumping substrates by contained paste deposition

Method of making solder balls by contained paste deposition

A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls

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Cupertino, CA, United States of America

Matthew K Schwiebert