Henkel IP Holding Gmbh

Loctite (r&d) Limited

Henkel Ag & Company, Kgaa

Henkel Corporation

Henkel Ireland Limited

Loctite Corporation

Matthew James Holloway

Barry N Burns

Puwei Liu

Jonathan P Wigham

Blake Olsen

Mary B Ward

My Nhu Nguyen

Rainer Schoenfeld

Emilie Barriau

Olaf Lammerschop

Rajat K Agarwal

Martin Renkel

Martin J Fitzpatrick

Hubert K Schenkel

Jason Brandi

Eadaoin D Ledwidge

John Killoran

Helen M Murray

Edward Ho

John E Cahill

Aisling Lakes

Rajat Agarwal

The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.

Di- or poly-functional electron deficient olefins coated metal powders for solder paste

Provided herein are electronic devices assembled with thermally insulating layers.

Electronic devices assembled with thermally insulating layers

The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.

Thermally decomposable polymer coated metal powders

This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.

Epoxy compositions having improved impact resistance

The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Photocurable adhesive compositions, reaction products of which have low halide ion content

Growing community of inventors

Naas, Ireland

Matthew James Holloway