International Business Machines Corporation

Matthew J Farinelli

Steven Alan Cordes

Sherif Ahmed Goma

James Patrick Doyle

Paul William Coteus

Gareth Geoffrey Hougham

Uttam Shymalindu Ghoshal

Alphonso Philip Lanzetta

Daniel Peter Morris

Chandler Todd McDowell

Joanna Rosner

Li Shi

David R DiMilia

Ali Afzali

Snigdha Ghoshal

Nisha Yohannan

John Ulrich Knickerbocker

George Andrew Keefe

Peter Alfred Gruber

James L Speidell

Matthias Steffen

Shwetank Kumar

Bing Dang

Paul Stephen Andry

Edmund Juris Sprogis

Minhua Lu

William Joseph Murphy

Hiroki Nakano

Cornelia K Tsang

Raymond R Horton

S Jay Chey

James Robert Rozen

Leena Paivikki Buchwalter

Robert E Trzcinski

Ronald Wayne Nunes

Winfried W Wilcke

James Vichiconti

Mohammed S Shaikh

Robert Barton Garner

Gobinda Das

Samuel McKnight

Frederic Beaulieu

Aparna Prabhakar

George Liang-Tai Chiu

Gene T Patrick

Frank Milliken, Jr

Adreanne Kelly

Steven J Duda

Ronald Richard Breton

Michael David Fregeau

Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.

Method of forming metallized elastomeric electrical contacts

An apparatus and method for manufacturing a superconducting low-pass filter for quantum computing devices. The apparatus includes a plurality of containers and input and output ports connected to opposite ends of the apparatus. A plurality of coils of superconducting wire are wound using a mandrel. An adhesive is applied to the coils for maintaining a wound state. Each of the coils are positioned in each of the containers and electrically connected to each other with at least one coil being connected to the input port and at least one coil being connected to the output port. The coils are released or expanded from their wound state using an adhesive solvent. The containers are then filled with a conductive polymer and the containers are closed with one or more covers.

Method of manufacturing superconducting low pass filter for quantum computing

A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.

Laser ablation of adhesive for integrated circuit fabrication

The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Direct edge connection for multi-chip integrated circuits

Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.

Techniques for improving bond pad performance

A method for determining whether a quantum system comprising a superconducting qubit is occupying a first basis state or a second basis state once a measurement is performed is provided. The method, comprising: applying a signal having a frequency through a transmission line coupled to the superconducting qubit characterized by two distinct, separate, and stable states of differing resonance frequencies each corresponding to the occupation of the first or second basis state prior to measurement; and measuring at least one of an output power or phase at an output port of the transmission line, wherein the measured output power or phase is indicative of whether the superconducting qubit is occupying the first basis state or the second basis state.

Microwave readout for flux-biased qubits

A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.

Laser release process for very thin Si-carrier build

Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 &#x3bc;m.

Interposer structures and methods of manufacturing the same

In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.

Method of producing UV stable liquid crystal alignment

A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Metalized elastomeric probe structure

Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Metalized elastomeric electrical contacts

An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

Structure for coupling probes of probe device to corresponding electrical contacts on product substrate

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Riverdale, NY, United States of America

Matthew J Farinelli