Applied Materials, Inc.

Matthew Herset

Kyle Moran Hanson

Daniel J Woodruff

John Lee Klocke

Nolan Layne Zimmerman

Klaus H Pfeifer

An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

Growing community of inventors

Kalispell, MT, United States of America

Matthew Herset