General Electric Company

Baker Hughes, a Ge Compnay, LLC

Ge Inspection Technologies, Gmbh

Ge Precision Healthcare LLC

Baker Hughes Holdings LLC

Waygate Technologies Usa, LP

Matthew Harvey Krohn

Paul Aloysius Meyer

Kwok Pong Chan

Nathan Smith

Fred Timothy Matthews

Vadim Bromberg

Prabhjot Singh

Alexander Felix Fiseni

Sven Runte

Williams Garcia

Bobby Dale Hournbuckle, Jr

Mark Rosenberg

Tara Merry

Naren Pradyumna Dasu

Mary Campos

Grigory Nudelman

Lowell Scott Smith

Douglas Glenn Wildes

Reinhold Bruestle

James Norman Barshinger

Stephan Falter

Ying Fan

Wei Luo

Chester Frank Saj

Mihirkumar Pravinbhai Patel

Adeodato Maria Vigano

Bobby Dale Hournbuckle

Nathan John Smith

A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.

Phased array ultrasonic transducer and method of manufacture

A method can include receiving data characterizing a first property of an asset over a first time period. The method can also include receiving data characterizing user interaction with an interactive graphical object. The method can further include determining, by a predictive model, data characterizing the first property of the asset over a second time period. The determining can be based in part on the received data characterizing the user interaction. The method can also include rendering, in a graphical display space, one or more of a first plot of the received data characterizing the first property over the first time period and a second plot of the determined data characterizing the first property over the second time period.

Industrial asset intelligence

An ultrasound transducer includes a transducer array having a plurality of transducer elements. The transducer array has a first side and a second side. Further, one or more ground electrodes are disposed on the first side of the transducer array, and one or more signal electrodes are disposed on the second side of the transducer array. Moreover, an acoustic backing structure is operatively coupled to the plurality of transducer elements of the transducer array. Also, a plurality of electrical traces is routed on a surface of the acoustic backing structure and operatively coupled to at least one of the one or more signal electrodes and one or more ground electrodes.

Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same

A method can include receiving data identifying an industrial asset. The method can also include receiving data characterizing one or more sensors configured to detect a first property of the asset. The method can further include determining a first graphical representation of the asset based on the received data identifying the industrial asset, and a second graphical representation of a first sensor of the one or more sensors based on the received data characterizing one or more properties of one or more sensors. The method can further include rendering, in a graphical display space, the first graphical representation and the second graphical representation. One or more visual properties of the second graphical representation can be indicative of one or more properties of the first sensor and/or the detected first property of the asset. A position of the second graphical representation in the graphical display space relative to the first graphical representation can be indicative of a first location of the first sensor on the asset.

Assemblies for an ultrasonic probe and manufacturing methods are presented. In one example, the method includes additively forming first portions of the assembly using a first material with first acoustic properties and second portions of the assembly using a second material with second acoustic properties, the first and second acoustic properties being configured to modify ultrasonic signals of the ultrasonic probe. In another aspect, a housing for an ultrasonic probe is presented. The housing includes additively-formed portions, a fluid channel, and at least one cavity. The first additively-formed portions include a first material with first acoustic properties. The second additively-formed portions include a second material with second acoustic properties. The first and second acoustic properties are configured to modify ultrasonic signals of the ultrasonic probe. The fluid channel is for receiving fluid within the housing of the ultrasonic probe.

Method for manufacturing an assembly for an ultrasonic probe

A piezoelectric composite for use in an ultrasonic transducer and a method of forming the same is provided. The composite has a piezoelectric ceramic component and a hydrophobic polymer component arranged to form a 1-3, 2-2, or 3-3 composite type. In one embodiment, the hydrophobic polymer is selected to polymerize at a moderate temperature.

Piezoelectric composite and method of forming same

A sensing device and a method of attaching the sensing device to a target object is disclosed. The substrate of the sensing device has one or more bonding material vias that allows the bonding material used to attach the substrate to the target object to flow from one side of the substrate to the other side of the substrate. The bonding material forms rivets to secure the substrate to the target object and to secure the layers of the substrate to each other.

Sensing device and method of attaching the same

A composite ceramic transducer structure for use in the construction of an ultrasound probe includes a substrate and a plurality of piezoelectric transducer posts. The plurality of piezoelectric transducer posts are controllably formed on the substrate in a plurality of spatial positions located on an X-Y plane of the substrate. The plurality of piezoelectric posts includes a plurality of shapes defined in an X-Y-Z plane of the substrate, wherein the plurality of piezoelectric transducer posts are configured to facilitate minimizing shear waves within the ultrasound probe.

Transducer structure for a transducer probe and methods of fabricating same

A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers surrounding a pure polyimide C-stage core.

Device for measuring material thickness

An acoustic transducer and method of making the acoustic transducer is disclosed. A transducer element for converting a signal between one of an electrical signal and an acoustic signal and the other of the electrical signal and the acoustic signal is provided. A backing to the transducer is additively fabricated to a side of the transducer element. The backing includes an electrically conductive path therein for conducting the electrical signal.

Direct writing of functionalized acoustic backing

A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120&#xb0; C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.

Device and system for measuring material thickness

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Reedsville, PA, United States of America

Matthew Harvey Krohn