Microsoft Technology Licensing, LLC

Matthew Gen

Bo Dan

Chau Van Ho

Spencer B Eggert

Greg Nielsen

Todd Chiles

Chien Lung Yang

The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.

Device cooling

Cooling of at least two heat generating electronic components of a computing device is described herein. The computing device includes the at least two heat generating electronic components. The at least two heat generating electronic components includes a first heat generating electronic component and a second heat generating electronic component. The first heat generating electronic component and the second heat generating electronic component are in thermal communication. The computing device also includes a first sensor operable to measure a first temperature. The first temperature is associated with the first heat generating electronic component. The first heat generating electronic component, the second heat generating electronic component, another heat generating electronic component of the at least two heating generating electronic components, or any combination thereof is configured to compare the first measured temperature to a predetermined temperature, and decrease a power for the second heat generating electronic component based on the comparison.

Shared cooling for thermally connected components in electronic devices

Growing community of inventors

Kirkland, WA, United States of America

Matthew Gen