Infinera Corporation

Matthew Fisher

Charles H Joyner

Peter Weindel Evans

Mark Missey

Pavel Viktorovich Studenkov

Donald J Pavinski

Amir Rashidinejad

August Spannagel

An optical network component and method are herein described. The system and method include determining a first power of an optical modulator using a first photodetector and a second power of the transmitter using a second photodetector, determining a contrast ratio based on the first power and the second power, and determining a modulation loss based on the contrast ratio.

Self-referenced method and apparatus for in-operation measurement of a coherent optical transmitter's modulation loss

The present invention provides a system, apparatus and method to maintain the polarization state of an optical signal propagating within a photonic integrated circuit, or from a first photonic integrated circuit to a second photonic integrated circuit. According to various embodiments of the invention, an optical circuit is provided which includes an optical coupler configured to accept a first optical signal on a first input and a second optical signal on a second input, the second optical signal having a polarization state. The optical coupler may combine the first and second optical signals into an optical output signal. A principle axis of a first end of an optical fiber is may be configured to align with the polarization state of the second optical signal, such that a polarization maintaining connection is established. The polarization state may be a TM polarization state, a TE polarization state, or another polarization state. The optical circuit may include birefringent structures, such as birefringent waveguides and birefringent wavelength selective couplers, to further maintain the polarization of optical signals propagating through the photonic integrated circuits.

Polarization control in a photonic integrated circuit

Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

Dual-level package

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Mountain View, CA, United States of America

Matthew Fisher