International Business Machines Corporation

Matthew F Cali

Pedro A Chalco

Laertis Economikos

James L Speidell

Edwin Joseph Selker

Jerome J Cuomo

Franck Barillaud

Anita Govindjee

Joseph D Rutledge

Donald J Mikalsen

Balaji Venkata Atyam

A computer-implemented method, apparatus, and computer program product are disclosed for optimizing the fractional allocation of a computing resource among multiple partitions in a data processing system. Multiple processing attributes are defined. A policy is generated for a first partition. The policy includes the definition of the processing attributes. Current values are determined for the first partition for the processing attributes. The policy and the current values are then used to determine a fractional portion of the resource to be allocated to the first partition.

Dynamic policy manager method, system, and computer program product for optimizing fractional resource allocation

A strain sensitive columnar transducer for a data entry keyboard contains a column upstanding from the keyboard. Strain sensitive orthogonally oriented patterns are formed on a single flexible planar sheet which is sliced to place each of the patterns on a separate tab. The planar sheet is forced over the column so that the patterns lie up against the sides of the column to measure force exerted on the column.

Force sensitive transducer for use in a computer keyboard

A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

Applying conductive lines to integrated circuits

A temperature sensing device for accurately measuring the temperature of a microbonding device tip. The temperature sensing device consists of an array of thin-film thermocouples produced by thin-film patterning techniques on a substrate card. Each thermocouple is composed of two circuit lines of dissimilar metals A & B. The dissimilar metals are superimposed at a junction point. A third metal C is deposited between the metals A and B to prevent premature degradation of the thermocouple junction. A common line is used for one of the two metals connecting to the junctions. This allows almost twice as many thermocouples than conventional layout techniques.

Temperature sensing device for dynamically measuring temperature

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Harriman, NY, United States of America

Matthew F Cali