Growing community of inventors

Brookline, MA, United States of America

Matthew Eli Carney

Average Co-Inventor Count = 3.53

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 229

Matthew Eli CarneyNeil Adam Gershenfeld (4 patents)Matthew Eli CarneyBenjamin Jenett (4 patents)Matthew Eli CarneyHugh Miller Herr (2 patents)Matthew Eli CarneyWilliam Kai Langford (1 patent)Matthew Eli CarneyChristopher Charles Williams (1 patent)Matthew Eli CarneyEmily Ann Rogers (1 patent)Matthew Eli CarneyDaniel Visan Levine (1 patent)Matthew Eli CarneyLucy Wei Du (1 patent)Matthew Eli CarneyMatthew Lawrence Handford (1 patent)Matthew Eli CarneyMatthew Eli Carney (6 patents)Neil Adam GershenfeldNeil Adam Gershenfeld (83 patents)Benjamin JenettBenjamin Jenett (10 patents)Hugh Miller HerrHugh Miller Herr (92 patents)William Kai LangfordWilliam Kai Langford (6 patents)Christopher Charles WilliamsChristopher Charles Williams (2 patents)Emily Ann RogersEmily Ann Rogers (1 patent)Daniel Visan LevineDaniel Visan Levine (1 patent)Lucy Wei DuLucy Wei Du (1 patent)Matthew Lawrence HandfordMatthew Lawrence Handford (1 patent)
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Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Massachusetts Institute of Technology (6 from 8,370 patents)


6 patents:

1. 11883305 - Computer-controlled ankle-foot prosthesis with series J-spring actuation

2. 11278235 - Neural efferent and afferent control of spring equilibrium, damping, and power in backdrivable and non-backdrivable series-elastic actuators comprising variable series stiffness mechanisms

3. 10710698 - Digital material assembly by passive means and modular isotropic lattice extruder system (MILES)

4. 10155313 - Discrete assemblers utilizing conventional motion systems

5. 10145110 - Digital material assembly by passive means and modular isotropic lattice extruder system

6. 9809977 - Digital material assembly by passive means and modular isotropic lattice extruder system

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as of
12/13/2025
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