Microsoft Technology Licensing, LLC

Amazon Technologies, Inc.

Matthew David Mickelson

Christopher Harry Stoumbos

Timothy Carlyle Shaw

Rob Huala

Hua Wang

Todd David Pleake

Ralf Groene

Summer L Schneider

David R Perek

Karsten Aagaard

Robyn Rebecca Reed McLaughlin

Kabir Siddiqui

Paul Henry Dietz

Eric Joseph Wahl

Christopher Strickland Beall

Anthony Reed

Thomas Charles Oliver

David Otto Whitt, Iii

Panos Costa Panay

David Carter Vandervoort

James Alec Ishihara

Nathan C Sherman

Sharon Drasnin

David Michael Lane

Joel Lawrence Pelley

Christopher Andrew Whitman

Robert D Young

Gene Robert Obie

Kevin M Bailey

James Charles Marshall

Moshe Randall Lutz

Matthew Christopher Smith

Bhret Robert Graydon

Jim Tom Belesiu

Darryl I Jensen

John Jacob Nelson

Jonathan Bernard Lester

Rahul R Marwah

Camilo Leon

Harold F Mantooth

Hiroo Umeno

Heather Anne Ralph

James H Wise

Dennis J Mathias

Chun Beng Goh

Michael A Schwager

Andrew N Cady

Brad Nathaniel Arnold

Stephan Alexander Cummings

Mark J Seilstad

Hakon Strande

Van Winston Oler

Matthew G Pedersen

Amey Madhukar Teredesai

Dane M Hansen

David Neff

Jose R Sousa

Daniel Joseph Peters

Lauren Akemi Hamamoto Donegan Ryan

Jiannan Chen

Richard Peter Spooner

David Otto Whit, Iii

Timothy Caryle Shaw

Edward C Iii Giaimo

Robyn Rebecca Reed Mclaughlin

Rajesh Manohar Dighde

Edward C Giaimo Iii

David Otto Iii Whitt

Bernard Maurice Schultz

Anthony Christian Reed

Jay Scott Kassels

Shane Aaron Sykes

Scott K Gibson

Iii David Otto Whitt

Darryl L Jensen

Iii Edward C Giaimo

Davie M Lane

Darryl Jensen

Jamesh Wise

Matthew G Pederson

Scott Mitchel Mail

During operation, a facility may utilize many sensors, such as cameras, to generate sensor data. Some of these sensors may be housed within protective enclosures. The enclosures may be inside specially controlled environments, such as refrigerators, freezers, and so forth. During operation of the facility, moisture may accumulate on these enclosures, impairing the ability of the camera to acquire an image through the window. Described are devices to selectively heat a viewable area of the window such that moisture accumulation is reduced with minimal power use.

Window heater system

A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.

Metal layering construction in flex/rigid-flex printed circuits

Sensor window heating apparatus

Flexible hinge spine techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Multiple position input device cover

Flexible hinge and removable attachment techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Flexible hinge and removable attachment

Input device manufacture techniques are described. In one or more implementations, a plurality of layers of a key assembly is positioned in a fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers. The positioned plurality of layers is secured to each other.

Method of manufacturing an input device

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.

Input device securing techniques

Techniques for fabric lamination to a component are described. According to various implementations, a single piece of fabric is laminated to a moveable component and to an apparatus to which the moveable component is attached. Generally, lamination of fabric to a moveable component and portions of an associated apparatus can enhance a user experience in a variety of ways. Embodiments may also be employed to cut fabric from around a surface component of an apparatus.

Fabric lamination to a component

Key formation techniques are described. In one or more implementations, an input device includes a key assembly including a plurality of keys that are usable to initiate respective inputs for a computing device, a connection portion configured to be removably connected to the computing device physically and communicatively to communicate signals generated by the plurality of keys to the computing device, and an outer layer that is configured to cover the plurality of keys of the key assembly, the outer layer having a plurality of areas that are embossed thereon that indicate one or more borders of respective said keys.

Key formation

Flexible hinge spine

Flexible hinge protrusion attachment

Input device assembly techniques are described. In one or more implementations, an input device includes a key assembly including a plurality of keys that are usable to initiate respective inputs for a computing device, a connection portion configured to be removably connected to the computing device physically and communicatively to communicate signals generated by the plurality of keys to the computing device, a flexible hinge that physically connects the connection portion to the key assembly, and an outer layer that is configured to cover the plurality of keys of the key assembly, form an outer surface of the flexible hinge, and is secured to the connection portion such that the outer layer wraps around at least two sides of the connection portion.

Input device assembly

Sensor stack venting techniques are described. In one or more implementations, one or more vent structures are formed within layers of a pressure sensitive sensor stack for a device. Vent structures including channels, holes, slots, and so forth are designed to provide pathways for gas released by feature elements to escape. The pathways may be arranged to convey outgases through the layers to designated escape points in a controlled manner that prevents deformities typically caused by trapped gases. The escape points in some layers enable at least some other layers to be edge-sealed. Pathways may then be formed to convey gas from the edge-sealed layer(s) to an edge vented layer(s) having one or more escape points, such that feature elements in the edge-sealed layer(s) remain protected from contaminants.

Sensor stack venting

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Seattle, WA, United States of America

Matthew David Mickelson