Hewlett-packard Development Company, L.P.

Matthew Daniel Neumann

Bryan David Bolich

Sean Anthony Cerniglia

Timothy Michael Rau

A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.

Modular data center

An airflow restrictor door is pivotably supported by and extends from a support towards a card receiving bay.

Airflow restrictor door

A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Heatsinks and a spring in a baffle slot between adjacent components

Various apparatus and methods relating to a sequencer for connecting an electronic device to a circuit board are disclosed.

Growing community of inventors

Roseville, CA, United States of America

Matthew Daniel Neumann